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liquid ink

A technology of ink and liquid, applied in the direction of ink, application, coating, etc., can solve the problems of large volume, difficult connector connection, etc., achieve the effect of simple process, maintain rigidity, and achieve reflow resistance

Inactive Publication Date: 2016-08-17
RESONAC CORPORATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if the boards of these wiring boards are connected by connectors, the volume becomes large, so it has been difficult to connect them by connectors

Method used

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  • liquid ink
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0079] Dissolve 7 g of N-phenyl-3-aminopropyltrimethoxysilane (KBM573, trade name manufactured by Shin-Etsu Silicone Co., Ltd.) as a surface treatment agent in 300 g of methyl ethyl ketone, and add 700 g thereof while stirring as Silica F05-12 (trade name, manufactured by Fukushima Ceramics Co., Ltd.) was crushed, followed by further stirring at room temperature for 1 hour. Agglomerated components of the crushed silica were filtered through a 200-mesh nylon cloth to obtain a slurry-like filtrate (silica slurry). 350g of a copolymer of glycidyl methacrylate, ethyl acrylate and butyl acrylate (weight average molecular weight 1.3 million, epoxy equivalent 7800, Tg-45°C) as an acrylic resin in methyl ethyl ketone (MEK) solution (concentration: 20% by mass), 34.2g of MEK solution (concentration: 50% by mass) of biphenyl aralkyl type epoxy resin (NC-3000H, trade name manufactured by Nippon Kayaku Co., Ltd.), 25.8g of phenolic resin (LA-3018 , Dainippon Ink Co., Ltd. product name) M...

Embodiment 2～11

[0080] Examples 2-11, Reference Examples 1-4 and Comparative Examples 5-8

[0081] A liquid ink was prepared in the same manner as in Example 1, except that each material shown in Tables 1 and 2 was used in the compounding ratio shown in the table. The mixing ratio of organic polymer, thermosetting resin and curing agent is based on the mass of the thermosetting resin composition except for the inorganic filler, and the mixing ratio of the inorganic filler is based on the total solid content of the thermosetting resin composition (in liquid ink Components other than the solvent) are based on the mass of the compounding ratio.

Embodiment 12

[0083] Dissolve 7 g of N-phenyl-3-aminopropyltrimethoxysilane (KBM573, product name manufactured by Shin-Etsu Silicone Co., Ltd.) as a surface treatment agent in 300 g of cyclohexanone, and add 700 g of it as a spherical dimethicone while stirring. Silica SO-25R (trade name manufactured by Admatechs Co., Ltd.) was further stirred at room temperature for 1 hour. Agglomerated components of the spherical silica were filtered using a 200-mesh nylon cloth to obtain a slurry-like filtrate (silica slurry). 350 g of a cyclohexanone solution (concentration 20% by mass) of a copolymer of glycidyl methacrylate, acrylonitrile, ethyl acrylate, and butyl acrylate (weight average molecular weight: 450,000, Tg-14.7°C) as an acrylic resin, 34.2 g of cyclohexanone solution (concentration: 50% by mass) of biphenyl aralkyl type epoxy resin (NC-3000H, trade name manufactured by Nippon Kayaku Co., Ltd.), 25.8 g of phenolic resin (LA-3018, Dainippon Ink Co., Ltd. propylene glycol monomethyl ether s...

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Abstract

Provided is a liquid ink containing: a thermosetting resin composition comprising an organic polymer, a thermosetting resin, and an inorganic filler; and a solvent for dissolving or dispersing the thermosetting resin composition. When the thermosetting resin composition is cured, there is formed a cured product (1) having a storage elastic modulus at 25°C of 500 MPa or lower, and a tensile elastic modulus of 0.5 to 3.0 GPa.

Description

technical field [0001] This invention relates to liquid inks. Background technique [0002] Conventionally, various printed wiring boards having one side, two sides, or multiple layers have been widely used in the fields of industrial equipment and consumer equipment. It is rare to use only one printed wiring board in electronic equipment, for example, a plurality of printed wiring boards divided by function are generally used. Usually, a plurality of distribution boards are connected by various connectors. [0003] Electronic equipment is expected to be thin, light and small. Especially in recent years, mobile phones, video cameras, and notebook computers have embedded high-density printed wiring boards represented by thin, light and small sizes. In these electronic devices, it is necessary to compactly embed a plurality of printed wiring boards in a limited space. However, if the boards of these wiring boards are connected by a connector, the volume becomes large, so it...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09D11/107C09D11/102C09D11/103H05K1/02
CPCC08G59/621C09D11/10C09D133/04C09D163/00H05K1/0393H05K3/285C08L77/00C08L33/04
Inventor 竹内一雅
Owner RESONAC CORPORATION