Preparation method of LTCC (Low Temperature Co-fired Ceramic) section sample

Abstract

The invention provides a preparation method of an LTCC (Low Temperature Co-fired Ceramic) section sample. According to the preparation method, a section sample preparation is finished by co-operation of a sample fixing stage, a test sample grinding and polishing stage and a test sample corrosion stage. In the sample fixing stage, a product to be subjected to preparation is put into a mould and poured by a prepared curing agent for curing; in the test sample grinding and polishing stage, a cured test sample is cut and a section is ground and polished to obtain a primary section sample; in the test sample corrosion stage, the surface of the polished section is corroded by a prepared corrosive solution to obtain a corroded section, and a final sample is obtained by cleaning and wiping the corroded section. The preparation method provided by the invention not only solves the problems in an ion beam cutting method with high cost and long period, but also solves the problem that the metal appearance of section extension by adopting a grinding and polishing method is damaged; the test cost is reduced when precision requirements on the section sample preparation are high; meanwhile, the complexity is not increased almost; the section definition of a product is improved; the defects of a production process can be exposed; the process quality of the product can be recovered. The preparation method provided by the invention has the advantages of simplicity and convenience in operation, low cost and very good application and popularization values in engineering.

Description

technical field [0001] The invention belongs to the technical field of electronic components, in particular to a preparation method for LTCC section sample preparation. Background technique [0002] LTCC technology is to make low-temperature sintered ceramic powder into a green tape with precise thickness and density, and use laser drilling, micro-hole grouting, precision conductor paste printing and other processes on the green tape to make the required circuit pattern, and then Multiple passive components such as low capacitance capacitors, resistors, filters, impedance converters, couplers, etc. are embedded in a multilayer ceramic substrate and then laminated together. The inner and outer electrodes can be made of silver, copper, gold and other metals respectively, and sintered at 900°C to make a high-density circuit that does not interfere with each other in three-dimensional space. It can also be made into a three-dimensional circuit substrate with built-in passive com...

AI Technical Summary

Problems solved by technology

[0034] The technology of the present invention solves the problem: the cross-section metallization morphology of the LTCC product obtained by using the prior art sample preparation will cover the defects at the interface of each layer with a metal with good ductility, wh...

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