Method for manufacturing electronic product composite material shell through resin transfer molding process

A technology of resin transfer molding and electronic products, which is applied in the field of molding composite material shells to achieve the effects of high mechanical strength, high production efficiency and light texture

Inactive Publication Date: 2014-05-21
GUANGDONG JANUS SMART GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the application of this process to electronic products with a thickness of less than 1 mm has not been reported.

Method used

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  • Method for manufacturing electronic product composite material shell through resin transfer molding process

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0018] To make a single-layer glass fiber composite electronic product casing, the manufacturing steps are:

[0019] First mix an appropriate amount of gel coat and accelerator, then mix with a certain amount of curing agent evenly, and then use a gel coat sprayer to spray a thin layer of the above premixed gel coat in the cavity of the female mold; after the gel coat is completely cured, you can Spread a layer of glass fiber cloth in the mold cavity;

[0020] At this time, the mold is closed, and the unsaturated polyester resin and curing agent automatically mixed by the equipment are injected into the mold cavity under a certain pressure;

[0021] Curing the resin at room temperature, demoulding, and taking out the composite material from the female mold cavity;

[0022] At this time, the main process steps have been completed, and then CNC is used to remove the overflow around the composite material, and the final spraying and printing processes are carried out to obtain t...

Embodiment 2

[0024] To make a single-layer Kevlar fiber composite electronic product casing, the manufacturing steps are as follows:

[0025] Spread a layer of Kevlar fiber cloth in the cavity of the female model; after closing the mold, the equipment will automatically mix epoxy resin and curing agent and inject it into the cavity of the mold under a certain pressure; The composite material is removed from the mold cavity.

[0026] After the main process is completed, the product can be post-processed, and the flash around the composite material is removed by laser engraving; the composite material is injected into the mold to form a buckle structure on the composite material; the composite material with a buckle structure is finally processed Spraying and printing process, you can get electronic product Kevlar composite shell.

Embodiment 3

[0028] To make a double-layer carbon fiber composite material electronic product casing, the manufacturing steps are as follows:

[0029] Spread two layers of carbon fiber cloth in the cavity of the female model; close the mold, vacuumize, press the equipment operation key, so that the bismaleimide resin and curing agent automatically mixed by the equipment are injected into the cavity of the mold; heat and cure the resin, De-mold and remove the composite from the female cavity.

[0030] After the main process is completed, use CNC to remove the overflow around the composite material; perform in-mold injection molding on the composite material, so that a buckle structure is formed on the composite material, and then the carbon fiber composite material with the buckle structure is finally sprayed and printed. Carbon fiber composite housings for electronics are available.

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Abstract

The invention discloses a method for manufacturing an electronic product composite material shell through a resin transfer molding process. The method comprises the steps of (1), spreading fibers, namely spreading preformed fiber cloth in a clean female mould cavity; (2), injecting resin, namely injecting premixed resin and a curing agent into the mould cavity with the spread fiber cloth through a certain injection pressure; and (3), curing the resin, namely curing the resin at an appropriate temperature. The method has the beneficial effects that as the resin transfer molding process is applied to the a thin-wall electronic product shell, the thickness of a product can be controlled to be within 1mm. compared with an electronic product metal shell with the same thickness, the product shell prepared by the method is lighter in weight and higher in production efficiency; compared with an electronic product engineering plastic shell with the same thickness, the product shell prepared by the method is better in mechanical strength.

Description

technical field [0001] The invention relates to a molding method of a composite material shell, more specifically, the invention particularly relates to a method for manufacturing a composite material shell of an electronic product by using a resin transfer molding process. Background technique [0002] The resin transfer molding process in the prior art refers to placing fiber materials that have been designed and cut according to performance and structural requirements in advance in the mold cavity, closing the mold under certain process conditions, and using vacuum or injection devices to provide It is a molding process in which the prepared resin is injected into a closed mold from an appropriate position to make it soak into the reinforcing material, and then the resin is cured by heating or at room temperature, and finally demolded to obtain a composite material molding product. [0003] Resin transfer molding technology is an advanced composite material liquid molding...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C70/48
CPCB29C70/48
Inventor 毕英慧王长明谢守德
Owner GUANGDONG JANUS SMART GRP CO LTD
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