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Proportional compression densification method of al-si encapsulation material

A packaging material and densification technology, which is applied in the field of densification treatment of the packaging material, can solve the problems of limited number of deposited ingots, low material utilization rate, high manufacturing cost, etc., to avoid coarsening of microstructure and simplify densification treatment Process and process, the effect of reducing equipment investment

Active Publication Date: 2016-09-07
CHINA WEAPON SCI ACADEMY NINGBO BRANCH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the Al-Si packaging material prepared by spray deposition is mainly densified by hot isostatic pressing process with high temperature and high pressure. The cost of hot isostatic pressing equipment required for this densification process is relatively large; The number of deposited ingots is limited, and multi-batch processing is often required, which takes a long time and low processing efficiency; at the same time, the densified round ingots are wire-cut into blanks of the required shape and then machined into chip packaging shells. Long cycle time, low material utilization rate, high manufacturing cost

Method used

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  • Proportional compression densification method of al-si encapsulation material
  • Proportional compression densification method of al-si encapsulation material
  • Proportional compression densification method of al-si encapsulation material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0050] Example 1, such as figure 1 As shown, the mold involved in this embodiment includes a die 2, a lower template 4, an ejector rod 5, an ejection backing plate 21, a punch 1 and an upper template 3, the die 2 has a cavity for placing materials, and the lower die 2 has a cavity for placing materials. The template 4 is set on the bottom surface of the die 2 and has a through hole in the middle, the ejector backing plate 21 is arranged at the bottom of the cavity, and the ejector rod 5 is arranged in the through hole of the lower template 4 so that it can move up and down and can push the ejector out of the backing plate 21. The punch 1 is set above the die 2 and can move up and down relative to the die 2, and the upper template 3 is set on the top surface of the punch 1.

[0051] The punch 1 is a punch of integral structure, and is fixed below the upper template 3 by bolts.

[0052] The lower end face of punch 1 is rectangular, and its specification depends on the shape and...

Embodiment 2

[0060] Embodiment 2, the mold reference embodiment 1 involved in the present embodiment, concrete steps are as follows:

[0061] (1) Al-Si alloy blanking and heating

[0062] The Al-27Si alloy deposition ingot prepared by spray deposition is selected, and the blanking specifications are: length 250mm, width 180mm, and height 400mm. Heating temperature (345°C ~ 505°C), keep warm for 3h ~ 5h after reaching the temperature.

[0063] (2) Proportional compression and densification

[0064] The concave model cavity used is 350mm in length and 245mm in width. After the mold is assembled, the overall heating is carried out, the mold heating temperature (345 ° C ~ 455 ° C), after reaching the temperature, keep warm for 3 ~ 5 hours.

[0065] After the mold is heated, it is assembled on the hydraulic press. After the lubricant is applied to the rectangular working end face of the punch, the side wall of the cavity of the concave mold, the surface of the ejection pad and the surface of...

Embodiment 3

[0066] Example 3, such as image 3 with Figure 4 As shown, the mold involved in this embodiment includes a die 2 , an ejector backing plate 21 , a lower die 4 , an ejector rod 5 , an upper die 3 , a first punch 11 and a second punch 12 . The die 2 has a cavity for placing materials, the ejector backing plate 21 is arranged at the bottom of the cavity, the lower template 4 is arranged on the bottom surface of the die 2 and has a through hole in the middle, and the ejector rod 5 is arranged on the lower template so that it can move up and down 4 and can push out the backing plate 21, the upper template 3 is located above the die 2 and can move up and down relative to the die 2, the first punch 11 is located on the lower end surface of the upper template 3 and can be pre-deformed The second punch 12 is arranged on the lower end surface of the upper template 3 and forms a punch matched with the cavity of the die 2 together with the first punch 11 .

[0067] When the first punch...

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Abstract

Disclosed is a method for proportional compression and densification of an Al-Si encapsulating material. The method is characterized by including the following steps: (1) feeding materials of spray deposition Al-Si alloy billets containing less than or equal to 35% of Si and the balance Al in feeding specifications of equivoluminal feeding according to actual requirements; (2) heating the total material billets at the temperature of 345-505 DEG C and keeping the temperature for 3h-5h; (3) putting the alloy billets into a mould, heating the mould at the temperature of 345-455 DEG C, keeping the temperature for 3h-5h after the temperature is reached, starting a hydraulic machine to perform slow compression and densification, unloading and returning a male mould after compression, and finally ejecting the deformed billets. Compared with the prior art, the method has the advantages of low cost, short technological process and high material utilization rate.

Description

technical field [0001] The invention relates to an electronic packaging material, in particular to a densification treatment method of the packaging material. Background technique [0002] Al-Si alloy is a relatively typical electronic packaging material, which is widely used to package various electronic chips. At present, the spray deposition preparation process of Al-Si alloy is relatively mature. The principle is that the Al-Si melt is atomized into tiny solid particles and semi-solid droplets under the action of nitrogen (or other inert gases, etc.) to form a high-speed jet. , the particles and droplets in the jet impinge on the rotating deposition disk for energy conversion, deformation and spreading, and are cooled, solidified and stacked at a relatively high speed to form an Al-Si alloy deposition ingot. Voids (porosity) are inevitably formed in the Al-Si alloy deposition ingot formed by the stacking deposition of solid particles and semi-solid droplets. During the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F3/02C22F1/043
Inventor 陈刚陈伟辛海鹰翟景马力章国伟郭安振
Owner CHINA WEAPON SCI ACADEMY NINGBO BRANCH