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Preparation method for aluminum-coated ceramic substrate

A ceramic substrate and aluminum-coated technology, which is applied in the field of preparation of aluminum-coated ceramic substrates, can solve the problems of poor wettability of aluminum-ceramic interface and aluminum-coated ceramic substrates, and achieve the effect of solving poor wettability

Inactive Publication Date: 2014-06-04
SHANGHAI SHENHE THERMO MAGNETICS ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a method for preparing an aluminum-coated ceramic substrate that solves the problem of poor wettability of the aluminum-ceramic interface

Method used

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  • Preparation method for aluminum-coated ceramic substrate
  • Preparation method for aluminum-coated ceramic substrate

Examples

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Effect test

Embodiment 1

[0022] Embodiment one, such as figure 1 As shown, the preparation method of aluminum-coated ceramic substrates uses acid-base solution and deionized water to process transition metal copper sheets, Al 2 o 3 The ceramic substrate is cleaned to remove impurities on the surface of the material.

[0023] The surface of the aluminum sheet is polished with metallographic sandpaper to remove the surface oxide layer, followed by ultrasonic cleaning, spraying, pre-dehydration and other processes to clean the aluminum sheet to remove surface impurities.

[0024] According to the DBC process in Al 2 o 3 The surface of the ceramic substrate is coated with copper on both sides to form the substrate 1 . The temperature is set at 1065° C. to 1080° C., the sintering time is 20 minutes to 35 minutes, the atmosphere is a nitrogen protective atmosphere, and the oxygen content is 5 ppm to 40 ppm.

[0025] Place the cleaned aluminum sheet 2 on the surface of the copper sheet, and put the subs...

Embodiment 2

[0026] Embodiment two, such as figure 2 As shown, the preparation method of aluminum-coated ceramic substrates uses acid-base solution and deionized water to process transition metal zinc flakes, Al 2 o 3 The ceramic substrate is cleaned to remove impurities on the surface of the material.

[0027] The surface of the aluminum sheet is polished with metallographic sandpaper to remove the surface oxide layer, followed by ultrasonic cleaning, spraying, pre-dehydration and other processes to clean the aluminum sheet to remove surface impurities.

[0028] According to the electroless galvanizing process in Al 2 o 3 The surface of the ceramic base material is coated with zinc on both sides to form the substrate 1 .

[0029] Place the cleaned aluminum sheet 2 on the surface of the zinc sheet, put the substrate 1 into the hot pressing mold 3, and apply a pressure per unit area of ​​100N / m 2 ~20000N / m 2 , in a vacuum environment, heated to 380°C to 660°C, hot-pressed and sintere...

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Abstract

The invention provides a preparation method for an aluminum-coated ceramic substrate. The preparation method comprises the following steps: step 1, cleaning a ceramic base material; step 2, polishing the surface of an aluminum sheet and cleaning the aluminum sheet; step 3, coating transition metal on double surfaces of the ceramic base material to form a substrate; and step 4, disposing the cleaned aluminum sheet on the surface of the transition metal and putting the substrate into a hot pressing die for hot pressing. According to the preparation method for the aluminum-coated ceramic substrate, a metal transition layer is formed on the surface of ceramic at first, and through a Al-metal eutectic liquid phase, the problem of poor wetability of the interface of aluminum and ceramic is overcome.

Description

technical field [0001] The invention belongs to the field of semiconductor manufacturing, in particular to a method for preparing an aluminum-clad ceramic substrate. Background technique [0002] Direct copper clad ceramic substrates (DBC substrates) are widely used in products such as semiconductor refrigerators, power semiconductor modules, solid state relays and high-power LEDs due to their excellent electrical insulation properties and high thermal conductivity. However, when subjected to thermal cycles, there is a large internal stress between copper and ceramics, which is easy to generate cracks at the interface and cause the overall failure of the DBC substrate. Compared with DBC substrates, direct aluminum clad ceramic substrates (DBA substrates) not only have excellent thermal shock fatigue resistance, but also have light structural weight (44% lighter than DBC substrates with the same structure) and good aluminum wire bonding Capability and other advantages, it is...

Claims

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Application Information

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IPC IPC(8): C04B37/02
Inventor 俞晓东贺贤汉
Owner SHANGHAI SHENHE THERMO MAGNETICS ELECTRONICS CO LTD
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