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Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition

A conductive circuit and thermosetting technology, which is applied in the fields of printed circuit manufacturing, multilayer circuit manufacturing, semiconductor/solid-state device manufacturing, etc., can solve the problem of low mounting density

Inactive Publication Date: 2014-06-11
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, since the conventional printed circuit boards have a low mounting density and the number of pins of semiconductor elements to be mounted is about several thousand to ten thousand pins, it is not necessary to provide small-diameter and narrow-pitch openings.

Method used

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  • Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition
  • Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition
  • Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition

Examples

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Embodiment 2

[0133] As the epoxy resin, 70 parts by mass of a product name NC-3000H (manufactured by Nippon Kayaku Co., Ltd.), which is a biphenyl aralkyl type epoxy resin, was used. Synthesis example 2 of curing agent: 52.7 g of Wonderamine HM (WHM) [(4,4'-diamino)dicyclohexylmethane, manufactured by Nippon Chemical Co., Ltd. 6 g of 3,3'-dihydroxy-4,4'-diaminobiphenyl as a functional diamine, 108 g of trimellitic anhydride (TMA) as a tricarboxylic anhydride, and N-methyl-2- as an aprotic polar solvent 1281 g of pyrrolidone (NMP), the temperature in the flask was set to 80° C., and stirred for 30 minutes. After completion of the stirring, 192 g of toluene as an aromatic hydrocarbon capable of azeotroping with water was further added, and the temperature in the flask was raised to 160° C., followed by reflux for 2.5 hours. Store a theoretical amount of water in the moisture quantitative receiver, and after confirming that the distillation of water cannot be seen, remove the water and tolue...

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Abstract

This method for manufacturing a structure having a conductor circuit forms a first photo-sensitive resin layer into a pattern in a first pattern-forming step, in accordance with the shape of an opening formed on a heat-curable resin layer, whereby it is possible to provide an opening of a variety of shapes. In the method for manufacturing the structure having the conductor circuit, in addition to being possible to simultaneously form a plurality of openings, it is possible to decrease residue of the resin in the area surrounding the opening, unlike a case where an opening is formed by a laser. Therefore, even when the number of pins in a semiconductor element is increased and a need arises to provide numerous small openings, it is possible to adequately and efficiently manufacture a structure having excellent reliability.

Description

technical field [0001] The present invention relates to a structure having a conductive circuit, a method for producing the same, and a thermosetting resin composition. Background technique [0002] A printed wiring board, which is one of structures having conductive circuits, is a substrate on which a plurality of wiring layers are formed on a core substrate, and includes a copper-plated film laminate serving as a core substrate, and interlayer insulating layers provided between the wiring layers. material and solder resist on the outermost surface. A semiconductor element is usually mounted on a printed circuit board via a die solder material or an underfill material. In addition, if necessary, the entire surface may be sealed with a transfer sealing material, or a metal cover for the purpose of improving heat dissipation may be attached. In recent years, there is no limit to the reduction in thickness and size of semiconductor devices, and the increase in the density of...

Claims

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Application Information

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IPC IPC(8): H05K3/46H05K3/00
CPCH05K3/4697H05K1/03H05K2203/0582H05K3/4673H05K3/108C08J5/18C08K3/30C08K3/36C08K9/06C08L63/00C08L79/04C08K2003/3045C08K2201/003C08J2463/00C08J2479/04C08J2379/04C08J2363/00C08J2363/04C08L63/04Y10T29/49162G03F7/16G03F7/20G03F7/26G03F7/40H01L21/4857H01L23/49822H01L23/49838H05K3/06H05K3/105
Inventor 蔵渊和彦藤本大辅山田薰平名越俊昌
Owner HITACHI CHEM CO LTD
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