Filler wire argon tungsten-arc welding process for molybdenum-copper alloy and nickel-base superalloy

Abstract

The invention discloses a filler wire argon tungsten-arc welding process for a molybdenum-copper alloy and a nickel-base superalloy. The filler wire argon tungsten-arc welding process comprises the steps of surface processing, fixed point welding, preheating before welding, welding, weld pass cleaning and slow cooling after welding. A Ni-Fe-Cr system alloy welding wire is adopted in the filler wire argon tungsten-arc welding process, and the content of a Ni element in the welding wire is controlled, so that the density of a heat affected zone organization on one side, close to the molybdenum-copper alloy, of a connector can be effectively improved. The filler wire argon tungsten-arc welding process for the molybdenum-copper alloy and the nickel-base superalloy has the advantages of being convenient to operate, stable in connector performance, high in welding efficiency, convenient to popularize and apply and the like. The filler wire argon tungsten-arc welding process is particularly suitable for welding the molybdenum-copper alloy and the nickel-base superalloy, and also can be used for welding the molybdenum-copper alloy and other high-temperature alloys.

Description

technical field The invention relates to a fusion welding method between dissimilar materials, in particular to a welding of molybdenum-copper alloy and nickel-based superalloy, which belongs to the field of welding technology. Background technique Molybdenum-copper material is an alloy composed of two immiscible metal phases, molybdenum and copper. This material has the characteristics of both constituent metals, and can learn from each other to obtain good comprehensive performance. Molybdenum is an element with relatively good electrical and thermal conductivity in addition to high-conductivity metals such as gold, silver, and copper. Therefore, molybdenum-copper materials with high electrical and thermal conductivity metal copper are further added to have high electrical and thermal conductivity. Copper has a high thermal expansion coefficient, while molybdenum has a very low thermal expansion coefficient. Therefore, it can be made into a lower thermal expansion coeffi...

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Problems solved by technology

In addition, the thermal conductivity and linear expansion coefficient of molybdenum-copper alloy and nickel-based superalloy are quite different, and welding stress is likely to occur in the solder joint area during welding, forming microcracks and even further expanding under the action of stress to cause cracking

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