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Addition silicone rubber compound for protecting diode chip

A silicone rubber and composite technology, which is applied in the field of addition-type silicone rubber composites for diode chip protection, can solve the problems of high reverse current and low reverse current, and achieve the effect of low reverse current

Active Publication Date: 2014-06-18
MIANYANG WELLS ELECTRONICS MATERIAIS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present invention overcomes the deficiency that the reverse current of the diode is too high at room temperature and high temperature in the prior art, and provides an embodiment of an addition-type silicone rubber compound for diode chip protection, which reduces the reverse current of the diode at room temperature and high temperature

Method used

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  • Addition silicone rubber compound for protecting diode chip
  • Addition silicone rubber compound for protecting diode chip
  • Addition silicone rubber compound for protecting diode chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] Select 100 parts of vinyl silicone oil with a viscosity of 5000mPa·s, 50 parts of silane-treated silicon dioxide, 1.5 parts of titanium dioxide, 12 parts of H-containing silicone oil with a H content of 0.6%, 20 parts of vinyl MQ resin, and bond Force accelerator 1.0 parts, 1,3-divinyl-1,1,3,3-tetramethyldisiloxane platinum complex 10ppm, inhibitor 1-ethynyl cyclohexanol 0.4 parts, triphenyl Phosphine 0.03 parts.

Embodiment 2

[0056] Choose 100 parts of vinyl silicone oil with a viscosity of 1000mPa s, 50 parts of silane-treated silicon dioxide, 1.5 parts of titanium dioxide, 12 parts of H-containing silicone oil with a H content of 0.6%, 20 parts of vinyl MQ resin, and bond Force accelerator 1.0 parts, 1,3-divinyl-1,1,3,3-tetramethyldisiloxane platinum complex 50ppm, inhibitor 1-ethynyl cyclohexanol 0.4 parts, triphenyl Phosphine 0.03 parts.

Embodiment 3

[0058] Select 100 parts of vinyl silicone oil with a viscosity of 5000mPa·s, 100 parts of silane-treated silicon dioxide, 1.5 parts of titanium dioxide, 12 parts of H-containing silicone oil with a H content of 0.6%, 20 parts of vinyl MQ resin, and bond Force accelerator 1.0 parts, 1,3-divinyl-1,1,3,3-tetramethyldisiloxane platinum complex 10ppm, inhibitor 1-ethynyl cyclohexanol 0.4 parts, triphenyl Phosphine 0.03 parts.

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Abstract

The invention discloses an addition silicone rubber compound for protecting a diode chip. The addition silicone rubber compound comprises the following raw materials in parts by weight: 100 parts of vinyl silicone oil, 20-300 parts of silicon dioxide, hydrogen-containing silicone oil of which the mass content of H is 0.5-1.5%, 5-100 parts of vinyl-containing MQ resin, 0.05-5 parts of stick relay promoter, 1,3-divinyl-1,1,3,3-tetramethyldisiloxane platinum complex, 0.01-10 parts of pigment, and 0.01-1 part of inhibitor, wherein the molar ratio of H-Si to vinyl contained in the silicon rubber compound is 0.6-2, and the dosage of the 1,3-divinyl-1,1,3,3-tetramethyldisiloxane platinum complex is 2-200PPm of the overall silicon rubber compound. The overall silicon rubber compound is stored at the temperature lower than 10 DEG C by adding the inhibitor while an organic silicon elastomer with a network structure is formed by addition reaction of vinyl silicone oil, vinyl-containing MQ resin and H-containing silicon oil at high temperature of 100-150 DEG C. The compound is applied to protection of the diode chip, and has the effect that countercurrent of the diode at normal temperature and high temperature is low.

Description

technical field [0001] The invention relates to an addition-type silicone rubber compound for diode chip protection, which is mainly used for diode chip protection, so that it has very low room temperature and high temperature leakage current characteristics. Background technique [0002] As a semiconductor chip, a diode has unidirectional conductivity and is widely used in electronic circuits. It plays a very important role in many circuits. It is one of the earliest semiconductor devices and its application is very wide. [0003] There are many ways to protect the diode chip. The common ones are silicone rubber protection, glass passivation, polyimide protection, etc. Each method has its own advantages and disadvantages. Silicone rubber protection is the most commonly used method. The process is simple and the cost is low. Low, outstanding performance. [0004] Chinese patent 201110437927.8 mentions the use of silicone rubber protection to reduce stress; Chinese patent CN...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K13/06C08K9/06C08K3/36C08K3/22C08K5/05C08K5/50
Inventor 赵元刚陆南平
Owner MIANYANG WELLS ELECTRONICS MATERIAIS
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