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Method for separating semiconductor device composite

A technology for semiconductor and composite parts, which is applied in the field of dividing semiconductor device composite parts and can solve problems such as damage to semiconductor chips

Inactive Publication Date: 2015-12-23
OSRAM OPTO SEMICON GMBH & CO OHG
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Such materials can cause the soldering material to spread over the separation surfaces during soldering of the semiconductor chips and cause damage to the semiconductor chips

Method used

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  • Method for separating semiconductor device composite
  • Method for separating semiconductor device composite
  • Method for separating semiconductor device composite

Examples

Experimental program
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Effect test

Embodiment Construction

[0029] Elements that are the same, of the same type or have the same effect are provided with the same reference symbols in the figures.

[0030] The figures and the size ratios of the elements shown in the figures to one another are not to be regarded as being to scale. Rather, individual elements can be shown exaggerated for better visibility and / or for better understanding.

[0031] exist Figures 1 to 5 A schematic cross-sectional view of a part of the semiconductor component assembly 1 is shown in each case. The method is described by way of example with the aid of a semiconductor component assembly from which optoelectronic semiconductor chips, in particular light-emitting diode chips, are obtained during separation.

[0032] The semiconductor component assembly 1 has a carrier 5 with a main surface 50 . The semiconductor layer sequence 2 is arranged on the main face. The semiconductor layer sequence has an active region 20 provided for generating radiation. The acti...

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Abstract

The invention relates to a method for separating a semiconductor component assembly (1) having a carrier (5) with a main surface (50) and a semiconductor layer sequence (2) arranged on the main surface . Separation grooves (4) are formed in the semiconductor component assembly (1) by means of a first laser cut, wherein the separation grooves (4) separate the semiconductor component assembly (1) in a vertical direction extending perpendicularly to the main surface (50) Partially split only. The semiconductor component assembly (1) is completely divided along the dividing grooves (4) by means of a laser in the manner of dividing cutting.

Description

technical field [0001] The present application relates to a method for singulating a semiconductor component assembly. Background technique [0002] For separating semiconductor chips from semiconductor wafers or wafer assemblies, laser separation methods can be used. It has been found that residues generated during the method can cover the separation surface. Such materials can cause the soldering material to spread over the separation surfaces during soldering of the semiconductor chips and cause damage to the semiconductor chips. Contents of the invention [0003] It is an object to provide a simple and reliable method for singulating semiconductor component assemblies, in which the separated semiconductor chips can be reliably soldered. [0004] The object is achieved by a method for separating a semiconductor component assembly having a carrier with a main surface and a semiconductor layer sequence arranged on the main surface, wherein the carrier contains a semicon...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/40H01L33/00H01L33/38B23K26/364
CPCB23K2103/50B23K2103/172B23K26/38B23K26/40H01L33/0095H01L33/382B23K26/364H01L21/3043H01L21/78H01L21/6835H01L2221/68327
Inventor 吉多·韦斯艾伯特·配希塔莱尔
Owner OSRAM OPTO SEMICON GMBH & CO OHG
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