Welding type LED substrate and manufacturing technology thereof

Abstract

The invention discloses a welding type LED substrate and a manufacturing technology thereof. The welding type LED substrate comprises an LED light source and a substrate body. The surface of the substrate body is coated with a metal layer in a hot spraying mode. The LED light source is welded to the metal layer. The substrate body can be the bottom of an outer shell or a plane panel or a heat dissipating device with a cooling fin. According to the manufacturing technology of the welding type LED substrate, firstly, the surface of the substrate body is coated with the metal layer in the hot spraying mode, and secondly, the LED light source is fixed on the metal layer based on the welding technology. Compared with mechanical contact of existing heat conducting glue filling, the welding type LED substrate has the advantages that the LED light source direct welding method is adopted, the LED light source is fixed on the metal layer of the heat dissipating device, the heat conducting middle transition of an aluminum substrate is omitted, and the welded light source is higher in strength and better in stability. The metal layer is generally made of copper and other high-thermal conductivity welding metal. The LED light source can directly transmit the heat to the metal layer after being welded, then the heat is transmitted to the heat dissipating device through the metal layer to be dissipated, the heat resistance is reduced to the maximum extent, the heat conducting efficiency is improved, and the light attenuation of the LED light source is reduced.

Description

technical field [0001] The invention relates to a novel LED substrate, in particular to a substrate whose surface can be directly welded with an LED light source and a manufacturing process thereof. Background technique [0002] Light-emitting diode (LED), as the fourth-generation green lighting source internationally recognized, has unique advantages such as energy saving, environmental protection, no radiation, long service life, fast response speed, and impact resistance. With the continuous improvement of LED performance, its application fields continue to With the expansion, the application power of the light source is also continuously increasing, and the resulting heat generation is also greatly increased. Due to the heat generated by LEDs, especially power-type LED light sources, or when multiple light sources are used at the same time, the heat is concentrated and continues to generate heat, so there are strict requirements for light source heat dissipation, which n...

AI Technical Summary

Problems solved by technology

However, this technology also has major deficiencies in the heat dissipation performance of the LED light source.

On the one hand, the LED light source is fixed mechanically, and the joint surface cannot be completely flat. Generally, it is necessary to apply thermal paste to fill the gap. However, the thermal conductivity of thermal paste is small. Compared with metal welding, the thermal resistance is still relatively high. On the other hand, the heat of the LED light source is first transferred to the aluminum substrate through the bracket, and then the heat is transferred to the radiator by the aluminum substrate. The heat needs to be transferred twice. Compared with one heat transfer, the LED light source is directly transferred to the radiator. The heat dissipation is directly carried out by the heat dissipation fins of the radiator, and its thermal resistance is still large, and the heat transfer efficiency is poor, which will lead to unsatisfactory heat dissipation effect

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