Chip type wireless audio transceiver integrated system

An integrated system, chip technology, applied in recording information storage, instruments, etc., can solve the problems of increased area and volume, high power consumption, easy to be found, etc., to achieve the effect of small size, low power consumption, easy to hide

Active Publication Date: 2018-02-09
上海企诺电子科技有限公司
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  • Abstract
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Problems solved by technology

This requires a large amount of external layout and wiring to complete this connection, which will occupy a large amount of space on the circuit board and increase the difficulty of routing. The volume will also increase accordingly, so that the bug is large in size, power consumption is large, and it is easy to be found
Due to the large size of the bug, it is difficult for criminal investigators to find the installation location when installing the bug, and after installation, it is easy to be found, which interrupts the monitoring, and even threatens the personal safety of nearby criminal investigators who are responsible for monitoring because the bug is discovered

Method used

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  • Chip type wireless audio transceiver integrated system
  • Chip type wireless audio transceiver integrated system

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Embodiment Construction

[0020] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manners of the present invention will be described in detail below in conjunction with the accompanying drawings. However, those of ordinary skill in the art can understand that in the implementation manners of the present invention, many technical details are proposed for readers to better understand the present application. However, even without these technical details and various changes and modifications based on the following implementation modes, the technical solution claimed in each claim of the present application can be realized.

[0021] A preferred embodiment of the present invention relates to a chip-type wireless audio transceiver integrated system, including: a substrate board and a packaging case; the packaging case cooperates with the substrate board to form a standard package; the chip that realizes audio signal collection, processing and ...

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Abstract

The invention relates to the technical field of microelectronic chip packaging, and discloses a chip-type wireless audio transceiver integrated system. In the present invention, by cooperating the package shell and the substrate board to form a standard shape package, the chip that realizes audio signal collection, processing and emission is placed in the package shell, the patch is mounted on the substrate board, and the chip and the chip are realized by bonding technology. Electrical interconnection between chips. Use SIP technology to integrate the chip that realizes audio signal acquisition, processing and transmission into the same PCB circuit board, and package it into a package shell to form a tiny audio signal collection function, audio signal processing function and audio signal transmission function. integrated system. Compared with traditional bugs, this miniature bug has excellent characteristics such as small size, low power consumption, and easy concealment.

Description

technical field [0001] The invention relates to the technical field of microelectronic chip packaging, in particular to a chip-type wireless audio transceiver integrated system. Background technique [0002] With the development of semiconductor technology, in order to improve the performance of semiconductor devices while minimizing packaging, high-integration packaging technologies such as wafer-level packaging, systematic packaging, and chip-level packaging have been proposed. The device has system capabilities. [0003] However, SIP (System in a package) technology overcomes the technical difficulty of SOC (System on achip) chip packaging technology that it is difficult to integrate analog, radio frequency and digital functions in a small feature size, and has broad application prospects. The so-called systematic integration is to load one or more high-performance modules composed of bare chips and possible passive components in a package, including stacking multiple ch...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G11B31/00
Inventor 窦宏雁纪新明
Owner 上海企诺电子科技有限公司
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