Chip type wireless audio transceiver integrated system

An integrated system, chip technology, applied in recording information storage, instruments, etc., can solve the problems of increased area and volume, high power consumption, easy to be found, etc., to achieve the effect of small size, low power consumption, easy to hide
CN103928040BActive Publication Date: 2018-02-09上海企诺电子科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
上海企诺电子科技有限公司
Publication Date
2018-02-09

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Abstract

The invention relates to the technical field of microelectronic chip packaging, and discloses a chip-type wireless audio transceiver integrated system. In the present invention, by cooperating the package shell and the substrate board to form a standard shape package, the chip that realizes audio signal collection, processing and emission is placed in the package shell, the patch is mounted on the substrate board, and the chip and the chip are realized by bonding technology. Electrical interconnection between chips. Use SIP technology to integrate the chip that realizes audio signal acquisition, processing and transmission into the same PCB circuit board, and package it into a package shell to form a tiny audio signal collection function, audio signal processing function and audio signal transmission function. integrated system. Compared with traditional bugs, this miniature bug has excellent characteristics such as small size, low power consumption, and easy concealment.
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Description

technical field

[0001] The invention relates to the technical field of microelectronic chip packaging, in particular to a chip-type wireless audio transceiver integrated system. Background technique

[0002] With the development of semiconductor technology, in order to improve the performance of semiconductor devices while minimizing packaging, high-integration packaging technologies such as wafer-level packaging, systematic packaging, and chip-level packaging have been proposed. The device has system capabilities.

[0003] However, SIP (System in a package) technology overcomes the technical difficulty of SOC (System on achip) chip packaging technology that it is difficult to integrate analog, radio frequency and digital functions in a small feature size, and has broad application prospects. The so-called systematic integration is to load one or more high-performance modules composed of bare chips and possible passive components in a package, including stacking multiple ch...

Claims

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