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Bond wires and method for producing bond connections

A wire bonding and wire bonding technology, which is applied in chemical instruments and methods, layered products, metal layered products, etc., can solve problems such as electrical short circuits

Active Publication Date: 2017-06-13
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The plasma that occurs at this time can also lead to electrical short circuits inside and / or outside the component in unfavorable cases

Method used

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  • Bond wires and method for producing bond connections
  • Bond wires and method for producing bond connections
  • Bond wires and method for producing bond connections

Examples

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Embodiment Construction

[0019] Figure 1A A perspective view of a section of a bonding wire 1 is shown. The bonding wire 1 has exactly one monofilament 10 made of a first material and embedded in a matrix 20 made of a second material. To simplify the illustration, this section is shown as a straight lead section, the longitudinal direction of which extends in the direction z. The directions x and y run perpendicular to each other and to the direction of course of the bonding wire 1 , which is indicated by the direction z in the example shown.

[0020] In the example shown, the longitudinal direction of the bonding wire section is the same as the direction of its course. In theory, however, the bonding wire 1 can also be bent. In this case, along the direction of run of the bonding wire 1 it may not always result that the different cross-sectional planes E1 each extending perpendicularly to the direction of run of the wire are generally not parallel to one another. In the case of a bent bonding wir...

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Abstract

The bonding wire (1) has several filaments (10) and a matrix (20). The matrix is embedded into the filaments. The melting temperature of each filament at a pressure of 1013.25hPa is higher over 450[deg] C than the melting temperature of the matrix at a pressure of 1013.25hPa. The filament is made of materials consists of alloy, zinc, magnesium, aluminum, silver, gold, copper, beryllium, nickel, iron, palladium, platinum, chrome, rhodium, iridium, ruthenium, molybdenum, tantalum and tungsten. An independent claim is included for method for manufacturing an electrical component.

Description

technical field [0001] The present invention relates to bonding wire connections. Background technique [0002] Bonding wires are used, among other things, in power electronic modules and other electrical components. Here, they are partially subjected to very high currents. For example, in certain switched-on states, a very high inrush current load on the bonding wire can result, whereby the bonding wire can be destroyed explosively. In extreme cases, for example when the bonding wires are seated hermetically closed in the housing of the component, this can lead to pressure waves, as a result of which the component shatters. Furthermore, arcing may occur, due to which a cast ingot, such as a silicon cast ingot, becomes embedded in the bonding wire, evaporates and / or is ejected from the housing. In unfavorable cases, the resulting plasma can also lead to electrical short circuits inside and / or outside the component. Contents of the invention [0003] The object of the p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/49H01L21/60
CPCB32B15/01H01B1/02H01B1/023H01L24/45H01L24/48H01L24/85H01L2224/45014H01L2224/45015H01L2224/45028H01L2224/45138H01L2224/45139H01L2224/45144H01L2224/45147H01L2224/45155H01L2224/4516H01L2224/45164H01L2224/45169H01L2224/45171H01L2224/45173H01L2224/45176H01L2224/45178H01L2224/4518H01L2224/45181H01L2224/45184H01L2224/45218H01L2224/45223H01L2224/45224H01L2224/45238H01L2224/45239H01L2224/45244H01L2224/45247H01L2224/45255H01L2224/4526H01L2224/45264H01L2224/45269H01L2224/45271H01L2224/45273H01L2224/45276H01L2224/45278H01L2224/4528H01L2224/45281H01L2224/45284H01L2224/4556H01L2224/45565H01L2224/45618H01L2224/45623H01L2224/45624H01L2224/45638H01L2224/45639H01L2224/45644H01L2224/45647H01L2224/45655H01L2224/4566H01L2224/45664H01L2224/45666H01L2224/45669H01L2224/45671H01L2224/45673H01L2224/45676H01L2224/45678H01L2224/4568H01L2224/45681H01L2224/4847H01L2924/00011H01L2924/00014H01L2924/01004H01L2924/00H01L2924/01201H01L2924/01049H01L2924/01005H01L2924/01039H01L2224/43848
Inventor G·本宁格O·霍尔菲尔德
Owner INFINEON TECH AG