Preparation method of heat-conductive plastic adopting ordered space network structure

A technology of network structure and heat-conducting plastics, which is applied in the deep processing and application of polymer composite materials, can solve the problems that the heat-conducting network has no orientation and cannot fully exert its function, and achieve the effects of low filling, improved product performance, and high thermal conductivity

Inactive Publication Date: 2014-08-06
WUHU ZHEXIN NEW ENERGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The dispersion of thermally conductive fillers in the polymer matrix is ​​mostly disordered dispersion, with less effective contact, and the formed thermally conductive network has no orientation, and most of them are disordered thermally conductive networks, resulting in the inability of the thermally conductive filler to fully exert its effect

Method used

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  • Preparation method of heat-conductive plastic adopting ordered space network structure

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] First, mix graphene with a mass fraction of 5%, processing aids, and polyethylene (PE) particles with a high-speed mixer for 5 minutes; then put 1200 g of the mixed particles into the SCS micro-nano particle shaping and coating system, at a speed of 3000 rpm Processing for 10 minutes, discharging for 5 minutes. Finally, after hot-pressing the composite particles at 210°C and a pressure of 14 MPa for 30 minutes, a heat-conducting plastic with an ordered spatial heat-conducting network structure was obtained.

Embodiment 2

[0023] First, mix nano-alumina, processing aids and polyethylene (PE) particles with a mass fraction of 5% with a high-speed mixer for 5 minutes; then put 1200g of the mixed particles into the SCS micro-nano particle shaping and coating system, at a speed of 3000rpm Down processing 10min, discharge 5min. Finally, after hot-pressing the composite particles at 210°C and a pressure of 14 MPa for 30 minutes, a heat-conducting plastic with an ordered spatial heat-conducting network structure was obtained.

Embodiment 3

[0025] First, mix nano-copper powder with a mass fraction of 5%, processing aids, and polyethylene (PE) particles with a high-speed mixer for 5 minutes; then put 1200g of the mixed particles into the SCS micro-nano particle shaping and coating system, at a speed of 3000rpm Processing for 10 minutes, discharging for 5 minutes. Finally, after hot-pressing the composite particles at 210°C and a pressure of 14 MPa for 30 minutes, a heat-conducting plastic with an ordered spatial heat-conducting network structure was obtained.

[0026] The thermal conductivity of thermally conductive plastics with an ordered space thermally conductive network structure prepared by the above three methods is shown in Table 1:

[0027] Table.1 Table of thermal conductivity of thermally conductive plastics prepared with different thermally conductive fillers

[0028]

[0029] It can be seen from the above table that under the same conditions, the thermal conductivity of the thermally conductive pl...

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Abstract

The invention discloses a preparation method of heat-conductive plastic adopting an ordered space network structure. Firstly, resin particles, processing aids and heat-conductive packing are pre-mixed in a high-speed mixer, then the resin particles are coated with the heat-conductive packing through an SCS micro-nanoparticle shaping coating system to form composite particles adopting core-shell structures, and finally, the heat-conductive plastic adopting the ordered space network structure is prepared through a thermoforming process. According to the preparation method, the resin particles are evenly coated with nano-scale or submicron-scale heat-conductive powder, and formed spherical composite particles can fully play the surface effect of a conduction phase on the composite particles; the composite particles can be directly thermoformed, the thermoformed heat-conductive packing particles are arranged in a heat-conductive plastic base body in order to form an ordered space heat-conductive network, the role of the heat-conductive packing can be fully played under the lower packing quantity, the low packing quantity and the high heat conduction are realized, the product performance is improved, the technological process is simplified, the cost is reduced, and the application range is enlarged.

Description

Technical field: [0001] The invention relates to the field of deep processing and application of polymer composite materials, in particular to a method for preparing heat-conducting plastics with an ordered space network structure. Background technique: [0002] Thermally conductive plastics are widely used in electronics, chemical industry, electrical appliances, national defense, machinery manufacturing and other fields, and can be divided into structural type and filling type. Structural thermally conductive plastics are polymers that can conduct heat by themselves or after doping; filled thermally conductive plastics have thermal conductivity through the filling of thermally conductive fillers (metal powder or fiber, carbon nanotubes, alumina, silicon nitride, aluminum nitride, etc.) performance. Compared with the filled type, the thermal conductivity of the structural type of thermally conductive plastic is relatively low, and the cost is high. Currently, 90% of therm...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L23/06C08L23/12C08L55/02C08L67/02C08K3/04C08K3/08C08K7/00C08K3/22
CPCC08K3/04C08K3/08C08K3/22C08K2003/085C08K2003/2227C08K2201/011C08K2201/013C08L2203/30
Inventor 高博王伟赵夫涛姜银珠李佳胜
Owner WUHU ZHEXIN NEW ENERGY
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