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A kind of heat-conducting resin composition and preparation method thereof

A technology of thermally conductive resin and composition, which is applied in the field of thermally conductive resin composition and its preparation, which can solve the problems that resin materials cannot provide high enough thermal conductivity or mechanical strength, and achieve the effect of improving thermal conductivity

Active Publication Date: 2018-08-03
SHANGHAI GENIUS ADVANCED MATERIAL (GRP) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The techniques disclosed in the above patents cannot provide resin materials with sufficiently high thermal conductivity or mechanical strength, and it is difficult to apply some resin materials to components in electric and electronic parts because some fillers are highly conductive fillers

Method used

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  • A kind of heat-conducting resin composition and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] After mixing 15 parts by weight of polyamide resin and 25 parts by weight of boron nitride fibers with a diameter of 50 μm in a high-speed mixer for 3 minutes, the polyamide resin matrix filled with boron nitride fibers was prepared by the melt kneading and blending method of screw extrusion. The temperature of the twin-screw extruder from the feed port to the extrusion die is 170°C, 190°C, 210°C, 220°C, 220°C, and the speed of the main engine is 20 Hz.

[0040] 40 parts by weight of the boron nitride fiber-filled resin masterbatch made, with 100 parts by weight of polyamide resin, 2 parts by weight of boron carbide particles with a number average particle diameter of 150 μm, 0.5 parts by weight of tetrakis[β-(3,5- Di-tert-butyl-4-hydroxyphenyl) propionate] pentaerythritol ester, 1 weight part of γ-aminopropyltriethoxysilane, 0.5 weight part of calcium stearate, after mixing in proportion, adopt the molten Kneading and blending method is used to make thermal conductive ...

Embodiment 2

[0043] After mixing 4 parts by weight of polycarbonate resin and 1 part by weight of boron nitride fibers with a diameter of 1 μm in a high-speed mixer for 5 minutes, the boron nitride fiber-filled polycarbonate was prepared by the melt kneading and blending method of screw extrusion. Resin masterbatch, wherein the temperature of the twin-screw extruder from the feed port to the extrusion die is 190°C, 220°C, 230°C, 240°C, 240°C, and the speed of the main engine is 40 Hz.

[0044] 5 parts by weight of the boron nitride fiber-filled resin masterbatch made, with 100 parts by weight of polycarbonate resin, 20 parts by weight of boron carbide particles with a number average particle diameter of 10 μm, 0.8 parts by weight of three (2,4-ditertiary Butylphenyl) phosphite, 0.5 parts by weight of γ-glycidyl etheroxypropyl trimethoxysilane, 0.3 parts by weight of lauric acid diethanolamide, after mixing in proportion, adopt the melt kneading and blending method of screw extrusion to prep...

Embodiment 3

[0048] After mixing 9 parts by weight of polyphenylene sulfide resin and 15 parts by weight of boron nitride fiber with a diameter of 25 μm in a high-speed mixer for 4 minutes, the polyphenylene nitride fiber filled with boron nitride fiber was prepared by the melt kneading and blending method of screw extrusion. Thioether resin masterbatch, wherein the temperature of the twin-screw extruder from the feed port to the extrusion die is 180°C, 200°C, 220°C, 230°C, 230°C, and the speed of the main engine is 30 Hz.

[0049] 24 parts by weight of the boron nitride fiber-filled resin masterbatch made, and 100 parts by weight of polyphenylene sulfide resin, 50 parts by weight of boron carbide particles with a number average particle diameter of 80 μm, 1 part by weight of β-(4-hydroxyl- 3,5-di-tert-butylphenyl) n-octadecyl propionate, 0.2 parts by weight of γ-(methacryloyloxy)propyl trimethoxysilane, 0.3 parts by weight of lauric acid diethanolamide, proportional After mixing, the heat...

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Abstract

The invention belongs to polymer composite materials and relates to a heat-conduction resin composition and a preparation method thereof. The heat-conduction resin composition is prepared from 100 parts by weight of a thermoplastic resin, 5-40 parts by weight of a resin mother material filled with boron nitride fibers, 2-50 parts by weight of boron carbide particles, 0.1-0.5 parts by weight of a lubricant and 0.1-1 part by weight of an anti-oxidant. The heat-conduction resin composition has high thermal conductivity and high mechanical strength. The heat-conduction resin composition can be used for easy preparation of a high-thermal conductivity member and especially for preparation of members in electrical and electronic parts. The boron nitride heat-conduction fibers has bridge effects in the heat-conduction resin composition, can bond heat conduction filler particles individually dispersed in the base resin and can connect isolated heat conduction units to form a large heat-conduction network so that the filler components easily form a communication network and thus thermal conductivity is greatly improved.

Description

technical field [0001] The invention belongs to polymer composite materials, and relates to a heat-conducting resin composition and a preparation method thereof. Background technique [0002] In the field of electronic technology, due to the increasing integration of electronic circuits, the accumulation of heat will lead to an increase in the temperature of the device, resulting in a decrease in the stability of the device. In order to ensure long-term and high-reliability operation of electronic components, the heat dissipation capacity of materials becomes an important limiting factor affecting their service life. [0003] Due to their excellent mechanical properties and electrical insulating properties, polymer resin compositions are useful in various applications such as automotive parts, electronic and electrical parts, machine parts, and the like. In many cases, polymeric resin compositions are used as encapsulants for electronic and electrical devices or motors due ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L77/00C08L55/02C08L25/06C08L69/00C08L81/02C08K13/04C08K3/38C08K7/04C08J3/22B29C47/92B29C48/92
CPCB29C48/92B29C2948/9258B29C2948/92704C08J3/226C08J2325/06C08J2355/02C08J2369/00C08J2377/00C08J2381/02C08J2425/06C08J2455/02C08J2469/00C08J2477/00C08J2481/02C08K2201/003C08L25/06C08L55/02C08L69/00C08L77/00C08L81/02C08L2205/025C08L2205/03C08K13/04C08K7/04C08K3/38C08L23/06B29B7/46B29B7/90B29C48/40B29C2948/9259
Inventor 杨桂生赵陈嘉
Owner SHANGHAI GENIUS ADVANCED MATERIAL (GRP) CO LTD
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