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Alkali-soluble photosensitive resin prepared from maleic anhydride ring-opening modified branched oligomer and photoresist composition thereof

A technology of maleic anhydride and photosensitive resin, applied in the field of ultraviolet light curing, can solve the problems of affecting the resolution of photoresist, easy gelation, adding special reagents, etc.

Active Publication Date: 2017-08-25
SUZHOU RUIHONG ELECTRONIC CHEM CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional linear polymers such as epoxy resins, acrylic resins, etc., have large molecular weight, high viscosity, and long molecular chains, which lead to some disadvantages in the application of photoresists: the gap between the exposed part and the unexposed part is due to The entanglement of molecular chains leads to an increase in the edge roughness of the photoresist pattern, which affects the resolution of the photoresist
Commonly used branched polymer synthesis methods include stepwise polymerization, ring-opening polymerization, and living polymerization. These methods have some shortcomings: the synthesis process is complicated, easy to gel, and special reagents need to be added.

Method used

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  • Alkali-soluble photosensitive resin prepared from maleic anhydride ring-opening modified branched oligomer and photoresist composition thereof
  • Alkali-soluble photosensitive resin prepared from maleic anhydride ring-opening modified branched oligomer and photoresist composition thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] In a three-necked flask equipped with a stirrer, condenser and thermometer, add 18.06g propylene glycol methyl ether acetate, 2.15g methacrylic acid (MAA), 6.54g benzyl methacrylate (BZMA), 0.56g maleic anhydride (MA), 0.13g p-vinylbenzylmercaptan (VBT), and 0.34g azobisisobutyronitrile were mixed uniformly, then reacted at 90°C for 24 hours, and then kept to obtain product A. Raise the temperature to 110°C, mix 0.007g of polymerization inhibitor hydroquinone (HQ), 0.017g of catalyst (TPP) and 0.746g of hydroxyethyl acrylate (HEA) evenly, then drop them into system A at a constant speed, and keep warm for the reaction After 6 hours, product B was obtained.

[0016] Photoresist composition: 58 parts of an alkali-soluble photosensitive resin, 6 parts of a photoinitiator, 15 parts of a reactive diluent, 17 parts of a solvent, and 4 parts of a pigment. After mixing, magnetically stir until evenly mixed to obtain a liquid photoresist . Coat the photoresist on the copper pl...

Embodiment 2

[0018] In a three-necked flask equipped with a stirrer, condenser and thermometer, add 18.84g propylene glycol methyl ether acetate, 2.15g methacrylic acid (MAA), 6.54g benzyl methacrylate (BZMA), 0.56g maleic anhydride (MA), 0.54g p-vinylbenzylmercaptan (VBT), and 1.23g azobisisobutyronitrile were mixed uniformly, and reacted at 90° C. for 24 hours, and the product A was obtained by heat preservation. Raise the temperature to 120°C, mix 0.007g of polymerization inhibitor hydroquinone (HQ), 0.017g of catalyst (TPP) and 0.746g of hydroxyethyl acrylate (HEA) evenly, then drop them into system A at a constant speed, and keep warm for the reaction After 6 hours, product B was obtained.

[0019] 58 parts of an alkali-soluble photosensitive copolymer, 6 parts of a photoinitiator, 15 parts of a reactive diluent, 17 parts of a solvent, and 4 parts of a pigment are mixed and then magnetically stirred until uniformly mixed to obtain a liquid photoresist. Coat the photoresist on the cop...

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Abstract

The invention discloses an alkali-soluble photosensitive resin prepared from a maleic anhydride ring-opening modified branched oligomer and a photoresist composition thereof, belonging to the technical field of ultraviolet light curing. p-Vinylbenzylmercaptan contains both polymerizable double bonds and branch point mercapto groups, so it can form branched oligomers by copolymerizing with other vinyl monomers. The present invention uses p-vinylbenzyl mercaptan (VBT), methacrylic acid (MAA), benzyl methacrylate (BZMA) and maleic anhydride (MA) to synthesize branched alkali-soluble Resin, then undergoes a ring-opening reaction between the hydroxyl group on the hydroxyethyl acrylate (HEA) and the acid anhydride on the polymer chain, connects a double bond, introduces a photosensitive group, and improves the photosensitivity of the resin. At the same time, the acid anhydride ring-opens to generate a carboxyl group, increasing the The carboxyl content in the resin improves the alkali solubility of the resin. The reaction conditions of the invention are easy to control, the monomers used are simple in structure, convenient in source, excellent in polymer performance and good in the application of negative photoresist. The resulting polymer structure is shown below.

Description

technical field [0001] The invention relates to an alkali-soluble photosensitive resin prepared from a maleic anhydride ring-opening modified branched oligomer and a photoresist composition thereof, belonging to the technical field of ultraviolet light curing. Background technique [0002] Photoresists are mainly composed of film-forming resins, photoinitiators, solvents, pigments, additives and fillers. Traditional linear polymers such as epoxy resins, acrylic resins, etc., have large molecular weight, high viscosity, and long molecular chains, which lead to some disadvantages in the application of photoresists: the gap between the exposed part and the unexposed part is due to The entanglement of molecular chains leads to an increase in the edge roughness of the photoresist pattern, which affects the resolution of the photoresist. [0003] Branched polymers have a three-dimensional quasi-spherical structure, a large number of intramolecular voids, easily modified functiona...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F220/18C08F220/06C08F222/06C08F212/14C08F8/00G03F7/004G03F7/00
Inventor 刘晓亚郑祥飞刘敬成刘仁穆启道孙小侠卢杨斌
Owner SUZHOU RUIHONG ELECTRONIC CHEM CO LTD
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