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Adhesive material and its preparation method

A technology of adhesive bonding and adhesion promoter, applied in the direction of adhesives, epoxy glue, adhesive types, etc., can solve the problems of easy embrittlement and cracking, small volume shrinkage, long curing time, etc., and it is not easy to achieve Effects of cracking or embrittlement, extended chain segment, good flexibility

Inactive Publication Date: 2016-01-13
RESEARCH INSTITUTE OF TSINGHUA UNIVERSITY IN SHENZHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] There are two types of photothermal curing adhesive materials in the curing process: free radical polymerization and cationic polymerization. The reaction speed of free radical polymerization is faster than that of cationic polymerization, but it is easy to embrittle and crack
The volume shrinkage produced by cationic polymerization is small, and it is not easy to crack, but its curing time is longer

Method used

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  • Adhesive material and its preparation method
  • Adhesive material and its preparation method
  • Adhesive material and its preparation method

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0035] Such as figure 1 Shown, the preparation method of above-mentioned adhesive bonding material comprises the following steps:

[0036] In step S110, by weight, 5-15 parts of acrylate diluent, 5-15 parts of vinyl ether diluent and 2.5-3 parts of photoinitiator are mixed, stirred, and dissolved to obtain solution A. Wherein, the stirring speed is 200r / min. In one embodiment, two different photoinitiators are contained in the adhesive bonding material. When preparing, firstly, the acrylate diluent and a photoinitiator are mixed and dissolved, and then the vinyl ether diluent and the photoinitiator are added to the solution. Another photoinitiator, stirred to obtain solution A.

[0037] Step S120, adding 20-50 parts of cycloaliphatic epoxy resin, 20-50 parts of urethane acrylate and 5-15 parts of adhesion promoter to solution A in parts by weight, and stirring to obtain solution B . In one embodiment, the stirring speed is increased from 200r / min to 600r / min. After the ali...

Embodiment 1

[0041] The composition of a kind of adhesive bonding material is as shown in table 1:

[0042] The composition of the adhesive bonding material of table 1 embodiment 1

[0043]

[0044] The preparation method of above-mentioned adhesive bonding material is as follows:

[0045] According to the weight percentages of the components in Table 1, firstly, hydroxyethyl methacrylate and 2-hydroxy-2-methyl-1-phenylacetone were stirred at a stirring speed of 200r / min, dissolved, and then successively dissolved in the above solution Triethylene glycol divinyl ether group and 10-(4-biphenyl)-2-isopropylthioxanthone hexafluorophosphate were added, and the stirring speed and stirring time were 200 r / min and 30 minutes, respectively, to obtain solution A.

[0046] Then add CY184, CN966 and CN704 to solution A respectively, and increase the stirring speed to 600r / min at this time. After the above polymer is uniformly dispersed in the solution, stir for 1 hour to obtain solution B.

[00...

Embodiment 2

[0049] The composition of a kind of adhesive bonding material is as shown in table 2:

[0050] The composition of the adhesive bonding material of table 2 embodiment 2

[0051] Substance name

parts by weight

CY184

12.0

CY179

23.0

CN9893

30.0

CN704

12.0

1,6-Hexanediol diacrylate

5.0

Isobornyl Methacrylate

5.0

1,4-Cyclohexyldimethanol divinyl ether

10.0

1-Hydroxycyclohexyl phenyl ketone

1.6

Triarylsulfonium hexafluorophosphate

1.4

[0052] The preparation method of above-mentioned adhesive bonding material is as follows:

[0053] According to the percentage by weight of each composition in Table 2, at first 1,6-hexanediol diacrylate, isobornyl methacrylate and 1-hydroxycyclohexyl phenyl ketone were stirred, and the stirring speed was 200r / min, dissolved, Then, 1,4-cyclohexyldimethanol divinyl ether and triarylsulfonium hexafluorophosphate were successively adde...

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Abstract

The invention discloses a glue bonding material and a preparation method thereof. The glue bonding material comprises the following components in parts by weight: 20-50 parts of alicyclic epoxy resin, 20-50 parts of polyurethane acrylate, 5-15 parts of acrylate diluter, 5-15 parts of vinyl ether diluter, 5-15 parts of adhesion promoter and 2.5-3 parts of photoinitiator. The glue bonding material can simultaneously be subjected to free radical-cationic polymerization mixed curing; since the polyurethane acrylate polymer has sufficient flexibility, the epoxy resin has sufficient hardness, and the diluter or polyester molecule is grafted in the middle of the two main resins to perform the functions of prolonging chain segment and buffering, thereby ensuring the glue bonding material to have the advantages of favorable flexibility, low tendency to cracking or embrittlement and short curing time. The invention also discloses a preparation method of the glue bonding material.

Description

technical field [0001] The invention relates to the field of electronic packaging materials, in particular to an adhesive bonding material and a preparation method thereof. Background technique [0002] In the field of electronic packaging, commonly used adhesive bonding materials are solvent-based products, and are divided into one-component bonding materials and two-component bonding materials. However, the one-component adhesive material may be stimulated by external conditions of heat and light during storage to produce a gel phenomenon. For two-component adhesive bonding materials, accurate volume or weight ratios and mixing and stirring operations are required before glue application, and there will also be problems with air bubbles. Therefore, there is an optional curing time for two-component adhesive bonding materials. The problem. [0003] In general, photothermal curing adhesive materials are generally single-component, and the curing time is much shorter than t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/00C09J175/14
Inventor 张维丽陈建军符冬菊王晓伟檀满林马清叶立强李冬霜
Owner RESEARCH INSTITUTE OF TSINGHUA UNIVERSITY IN SHENZHEN