Insulating heat-conducting metal-to-metal adhesive and manufacturing method thereof

A technology of heat-conducting metal and manufacturing method, applied in the field of heat-conducting adhesive, can solve the problem of unrealizable heat dissipation, and achieve the effects of avoiding leakage, high thermal conductivity, and good application prospect.

Active Publication Date: 2014-09-10
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] For liquid metal, because of its phase change and heat absorption characteristics, it has high thermal conductivity. When the melting point range of liquid metal is near the working temperature of the chip, the liquid metal can perform the function of phase ch

Method used

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  • Insulating heat-conducting metal-to-metal adhesive and manufacturing method thereof
  • Insulating heat-conducting metal-to-metal adhesive and manufacturing method thereof
  • Insulating heat-conducting metal-to-metal adhesive and manufacturing method thereof

Examples

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Embodiment 1

[0056] Such as figure 1 Shown, a kind of manufacturing flowchart of insulating heat-conducting metal adhesive, described method comprises the steps:

[0057] Step S1, selecting the mass ratio of the thermally conductive filler of the liquid mixture and the insulating base material 2 to be 20:1;

[0058] Step S2, weighing 40g of low-melting-point gallium-indium alloy Ga: 24.5In, whose melting point is 15.7°C. At room temperature, the alloy is in a liquid state, and the gallium-indium alloy is heated in an air environment at a heating temperature of 50°C C; Stir the mixture of gallium-indium alloy and gallium-indium alloy oxide at a stirring rate of 500rpm for 0.1 to 10 hours until the mixture changes from liquid to paste, which can be used as a liquid mixture heat conducting filler ;

[0059] In step S3, the insulating base material 2 selects a type of HCY5299 low-viscosity flame-retardant two-component silicone heat-conducting potting glue, weighs 2g of silicone heat-conduct...

Embodiment 2

[0062] According to the preparation method of example 1, just change air into pure oxygen environment.

Embodiment 3

[0064] According to the preparation method of Example 1, only the insulating matrix material 2 is replaced by epoxy resin from silicone heat-conducting potting compound.

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Abstract

The invention provides an insulating heat-conducting metal-to-metal adhesive and a manufacturing method thereof. The insulating heat-conducting metal-to-metal adhesive is mainly composed of a micro-droplet-shaped mixture and an insulating substrate material, wherein the micro-droplet-shaped mixture is uniformly distributed in the insulating substrate material and is completely coated by the external insulating substrate material. The manufacturing method for the insulating heat-conducting metal-to-metal adhesive comprises the following steps: subjecting a selected low-melting-point metal or alloy to heating, stirring and oxidation so as to prepare a liquid mixture heat-conducting filling material; and fully mixing the liquid mixture heat-conducting filling material with the insulating substrate material with stirring so as to form the insulating heat-conducting metal-to-metal adhesive. The invention has the following beneficial effects: the insulating heat-conducting metal-to-metal adhesive inherits high heat conductivity and phase change endothermicity of liquid metal; the micro-droplet-shaped mixture is completely coated by the insulating substrate material with insulating properties, so insulating properties of the insulating heat-conducting metal-to-metal adhesive are guaranteed; and the adhesive can better meet demands of novel electronic products for both space compaction and electrically isolated electronic cooling.

Description

technical field [0001] The invention relates to the technical field of thermally conductive adhesives, in particular to an insulating thermally conductive metal adhesive and a manufacturing method thereof. Background technique [0002] In recent years, a large number of new electronic products such as smartphones, tablets, and ultrabooks have appeared in the market. Due to the needs of customer experience, major electronics manufacturers have minimized the thickness of the equipment, such as the Android launched by a mobile phone manufacturer. The thickness of the smartphone is only 6.9mm. [0003] With the high integration of electronic device chips, the power density of the device is getting higher and higher. Excessive power density in a very small space can easily lead to excessive local temperature of the device, and excessive temperature will slow down the operating speed of the device. , device malfunctions, human body burns, and many other performance issues. [00...

Claims

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Application Information

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IPC IPC(8): C09J183/04C09J163/02C09J11/04H05K7/20
Inventor 梅生福邓中山刘静
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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