Insulating heat-conducting metal-to-metal adhesive and manufacturing method thereof

Abstract

The invention provides an insulating heat-conducting metal-to-metal adhesive and a manufacturing method thereof. The insulating heat-conducting metal-to-metal adhesive is mainly composed of a micro-droplet-shaped mixture and an insulating substrate material, wherein the micro-droplet-shaped mixture is uniformly distributed in the insulating substrate material and is completely coated by the external insulating substrate material. The manufacturing method for the insulating heat-conducting metal-to-metal adhesive comprises the following steps: subjecting a selected low-melting-point metal or alloy to heating, stirring and oxidation so as to prepare a liquid mixture heat-conducting filling material; and fully mixing the liquid mixture heat-conducting filling material with the insulating substrate material with stirring so as to form the insulating heat-conducting metal-to-metal adhesive. The invention has the following beneficial effects: the insulating heat-conducting metal-to-metal adhesive inherits high heat conductivity and phase change endothermicity of liquid metal; the micro-droplet-shaped mixture is completely coated by the insulating substrate material with insulating properties, so insulating properties of the insulating heat-conducting metal-to-metal adhesive are guaranteed; and the adhesive can better meet demands of novel electronic products for both space compaction and electrically isolated electronic cooling.

Description

technical field [0001] The invention relates to the technical field of thermally conductive adhesives, in particular to an insulating thermally conductive metal adhesive and a manufacturing method thereof. Background technique [0002] In recent years, a large number of new electronic products such as smartphones, tablets, and ultrabooks have appeared in the market. Due to the needs of customer experience, major electronics manufacturers have minimized the thickness of the equipment, such as the Android launched by a mobile phone manufacturer. The thickness of the smartphone is only 6.9mm. [0003] With the high integration of electronic device chips, the power density of the device is getting higher and higher. Excessive power density in a very small space can easily lead to excessive local temperature of the device, and excessive temperature will slow down the operating speed of the device. , device malfunctions, human body burns, and many other performance issues. [00...

AI Technical Summary

Problems solved by technology

[0008] For liquid metal, because of its phase change and heat absorption characteristics, it has high thermal conductivity. When the melting point range of liquid metal is near the working temperature of the chip, the liquid metal can perform the function of phase change and heat dissipation, which greatly improves the heat dissipation of electronic equipment. However, due to the insurmountable difficulty that liquid metal has conductivity, the idea of ​​placing it in electronic components for heat dissipation cannot be realized

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