Manufacturing method of cover plate

A manufacturing method and cover plate technology, applied in the field of MEMS sensors, can solve the problems of the impact of cover plate manufacturing process efficiency, increase the difficulty of cover plate, complicated process flow, etc., and achieve convenient and easy process control, cost saving, and simplified manufacturing process. Effect

Inactive Publication Date: 2014-09-17
ADVANCED SEMICON MFG CO LTD
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  • Abstract
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  • Claims
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Problems solved by technology

[0004] In the manufacturing method of the cover plate in the prior art, the process of exposing and etching the front side and the back side respectively is adopted, the process flow is complicated, and a certain cavity formed on the front side needs to be aligned with a certain cavity formed on the back side. To a certain extent, it increases the difficulty of making the cover plate and affects the efficiency of the cover plate manufacturing process

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  • Manufacturing method of cover plate
  • Manufacturing method of cover plate
  • Manufacturing method of cover plate

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Embodiment Construction

[0020] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. When describing the embodiments of the present invention in detail, for the convenience of illustration, the schematic diagrams are not partially enlarged according to the general scale, which should not be taken as a limitation of the present invention.

[0021] The manufacturing method of the cover plate of the present invention can be widely used in various fields, especially suitable for MEMS sensors, and will be described below through a preferred embodiment. Of course, the present invention is not limited to this specific embodiment. Common substitutions known to the skilled person are undoubtedly within the protection scope of the present invention.

[0022] figure 1 It is a flow chart of the manufacturing method of the cover pla...

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Abstract

The invention provides a manufacturing method of a cover plate. The manufacturing method comprises the following steps of providing a base plate, and forming blocking layers on the front and back surfaces of the base plate; simultaneously performing double-side exposure on the blocking layers on the front and back surfaces of the base plate, so as to form a plurality of windows; etching the base plate through the windows; simultaneously performing double-side exposure on the blocking layers on the front and back surfaces of the base plate, so as to form figures and avoid aligning a front figure with a back figure of the base plate. The etching alignment precision is increased, the manufacturing flow is simplified, the cost is reduced, and the efficiency of the manufacturing process of the cover plate is improved. Additionally, the manufacturing method of the cover plate has the advantages of convenience in control and easiness in implementation, and the rate of finished products is increased to a certain degree.

Description

technical field [0001] The invention relates to the technical field of MEMS sensors, in particular to a method for manufacturing a cover plate. Background technique [0002] Micro-Electro-Mechanical System (MEMS) technology can integrate mechanical components, drive components, electronic control systems, digital processing systems, etc. into a micro-system as an overall unit. This kind of micro-electromechanical system can not only collect, process and send information or instructions, but also take actions independently or according to external instructions according to the acquired information. It uses the combination of microelectronics technology and micromachining technology (including micromachining of silicon body, micromachining of silicon surface, LIGA and wafer bonding and other technologies) to manufacture various sensors with excellent performance, low price and miniaturization. Actuators, drives and microsystems. It has many advantages such as tiny, intellige...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81C1/00
Inventor 刘奇斌徐元俊颜毅林
Owner ADVANCED SEMICON MFG CO LTD
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