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Low pressure arc plasma immersion coating vapor deposition and ion treatment

A coating system and coating technology, applied in the direction of plasma, coating, electrical components, etc., can solve the problem that the arc-deposited film does not have crystallization characteristics, etc.

Active Publication Date: 2014-09-17
VAPOR TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, arc-deposited films do not have the same crystalline characteristics as sputtered films because the arc-evaporation method produces a highly ionized plasma with high-energy deposited atoms that are thought to effectively randomize the crystal structure of the developing film

Method used

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  • Low pressure arc plasma immersion coating vapor deposition and ion treatment
  • Low pressure arc plasma immersion coating vapor deposition and ion treatment
  • Low pressure arc plasma immersion coating vapor deposition and ion treatment

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Embodiment Construction

[0067] Reference will now be made in detail to presently preferred compositions, embodiments and methods of the invention which constitute the best modes of practicing the invention presently known to the inventors. The drawings are not necessarily drawn to scale. It is to be understood, however, that the disclosed embodiments are merely exemplary embodiments of the invention, which may be embodied in different and alternative forms. Therefore, specific details disclosed herein are not to be interpreted as limiting, but merely as representative basis for any aspect of the invention and / or as representative examples for teaching one skilled in the art to variously employ the invention. sexual basis.

[0068] Except in the examples, or where otherwise expressly indicated, all numerical quantities in this specification expressing the amount of materials or conditions reacted and / or employed are to be understood as using the word "about "To modify. Practice stated within numeri...

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Abstract

A coating system includes a vacuum chamber and a coating assembly. The coating assembly includes a vapor source, a substrate holder, a remote anode electrically coupled to the cathode target, and a cathode chamber assembly. The cathode chamber assembly includes a cathode target, an optional primary anode and a shield which isolates the cathode target from the vacuum chamber. The shield defines an opening for transmitting an electron emission current of a remote arc discharge from the cathode target to the remote anode that streams along the target face long dimension. A primary power supply is connected between the cathode target and the primary anode while a secondary power supply is connected between the cathode target and the remote anode. Characteristically, a linear remote anode dimension and a vapor source short dimension are parallel to a dimension in which an arc spot is steered along the cathode target.

Description

technical field [0001] The present invention relates to a plasma-assisted deposition system and a related method, in particular to a coating system and a method for coating a substrate in the coating system. Background technique [0002] Physical vapor deposition (PVD) and low pressure chemical vapor deposition (CVD) sources are used for coating deposition and surface treatment. Conventional metal vapor sources such as electron beam physical vapor deposition (EBPVD) and magnetron sputtering (MS) metal vapor sources can provide high deposition rates. However, the low energy of metal vapor atoms and the low ionization rate of these processes result in low densities, poor adhesion, poor structure and morphology. It is well known that assisting coating deposition methods with bombardment with energetic particles greatly improves coatings by increasing the density of deposited materials, reducing die size and improving coating adhesion. In these processes, the surface layer is ...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/22C23C14/35
CPCH01J37/32587C23C14/355C23C14/3471H01J37/32055H01J37/3438C23C14/24C23C14/35C23C14/54H01J37/32H05H1/00
Inventor V·戈罗霍夫斯基W·格兰特E·泰勒D·胡梅尼克
Owner VAPOR TECH INC
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