Heat type wind speed and direction sensor based on substrate transfer process and packaging method thereof

Abstract

The invention discloses a heat type wind speed and direction sensor based on the substrate transfer process and a packaging method of the heat type wind speed and direction sensor. While the heat type wind speed and direction sensor is completely compatible with a traditional CMOS process, a ceramic substrate and a sensing chip are bonded through a heat conducting adhesive colloid, and after a silicon substrate is removed through corrosion or grinding, conduction of heat generated by heating elements of the sensor in a silicon-based chip can be completely removed; meanwhile, a sensing structure is located between the ceramic substrate and a silicon dioxide layer, due to the fact that the silicon dioxide layer has extremely low heat conduction coefficients and the ceramic substrate has large heat condition coefficients, a vast majority of heat generated by the heating elements is conducted upwards through heat conducting adhesive and the ceramic substrate and conducts heat exchange with the external environment through the forced heat convection effect, a vast majority of heat is used for sensing the change of the wind speed and direction in the external environment, heat losses caused by the heat conduction effect are small, and the sensor can acquire large sensitive signals under the low power consumption condition.

Description

technical field [0001] The invention relates to a thermal wind speed and direction sensor with low power consumption and high sensitivity, in particular to a thermal wind speed and direction sensor based on a substrate transfer process and a packaging method thereof. Background technique [0002] Thermal wind speed and direction sensors are widely used in the measurement of wind speed and wind direction. With the gradual increase of natural disasters at home and abroad in recent years, the requirements for meteorological monitoring are getting higher and higher. Therefore, thermal wind speed and direction with low power consumption and high sensitivity are realized. Sensors are of great importance. In the design of thermal wind speed and direction sensors based on CMOS technology, packaging has always been a technical bottleneck hindering its development. On the one hand, the packaging material requires both good thermal conductivity and protection for the sensor, and the d...

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Problems solved by technology

As a result, silicon wafers are easily subject to various contaminations, resulting in unstable performance and even damage.

If a ceramic substrate with high thermal conductivity is used, and the silicon chip of the sensor is packaged by flip-chip packaging or thermally conductive adhesive, the above contradictions can be better avoided, but the heat generated by the sensor after packaging is extremely large. Part of it is dissipated from the silicon-based substrate in the form of heat conduction, and only a small part is heat-exchanged with the outside air through the ceramic, which greatly reduces the amplitude of the output sensitive signal, and the sensitive signal can be improved by increasing the power consumption of the sensor. amplitude, but it causes a large power consumption of the entire sensor system

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