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Bonding material and bonding method in which said bonding material is used

A technology of bonding materials and solvents, applied in the direction of welding/cutting media/materials, welding equipment, welding media, etc., can solve problems such as oxidation of joint parts, and achieve high reliability

Inactive Publication Date: 2014-09-24
DOWA ELECTRONICS MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is concern about the oxidation of the joint part that may adversely affect the joint force in the joint part including the surface to be joined and the joint material.

Method used

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  • Bonding material and bonding method in which said bonding material is used
  • Bonding material and bonding method in which said bonding material is used
  • Bonding material and bonding method in which said bonding material is used

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0136] (Example 1, Comparative Example 1)

[0137] Mix the following materials to obtain a printable adhesive bonding material: as silver nanoparticles with an average primary particle size of 20nm, the caproic acid-coated silver nanoparticle powder obtained above; as a nanometer silver particle with an average primary particle size of 110nm Silver particles, the above-mentioned obtained sorbic acid-coated nano-silver particle powder; as submicron silver particles, 2-1C (manufactured by Tonghe Electronic Technology Co., Ltd.) spherical silver particle powder (average particle diameter (D 50 )800nm, wherein the particles were confirmed by SEM, and the results confirmed that the particles in the field of view were independent particles); as a low boiling point solvent, octanol with a boiling point of 194°C; as a high boiling point solvent, isobornyl ring with a boiling point of 318.3°C hexanol (MTPH); and as a dispersant, SOLPLUS D540.

[0138] In addition, as a comparative exa...

Embodiment 2

[0153] (Example 2, Comparative Examples 10, 11)

[0154] According to the ratio of the amount of low boiling point solvent to the amount of high boiling point solvent, it is low boiling point solvent: high boiling point solvent = 1:1 coordination embodiment 2, according to low boiling point solvent: high boiling point solvent = 5:3 coordination of comparative example 10, and according to Low boiling point solvent: high boiling point solvent = 1:3 The bonding material of Comparative Example 11 was prepared under the conditions shown in Table 1, and was produced in the same manner as in Example 1. The obtained results are shown in Table 1 together.

[0155] In addition, the ratio of the amount of low-boiling-point solvent to the amount of high-boiling-point solvent in Example 1 is low-boiling-point solvent:high-boiling-point solvent=3:5. In Comparative Example 10 in which the amount of the low-boiling-point solvent was more than half, the paste state was good and voids were not...

Embodiment 3

[0157] A bonding material was produced in the same manner as in Example 1 except that diethylene glycol hexyl ether (HeDG) having a boiling point of 260° C. was used as a usage example in which a high boiling point solvent was different. The obtained results are shown in Table 1 together. The state of the paste, the generation of voids, the initial bonding strength, and the reliability strength were all good results as in Example 1.

[0158] [Table 1]

[0159]

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Abstract

The purpose of the present invention is to enable highly-reliable bonding of bonding surfaces to be carried out such that the occurrence of uneven drying at the center and ends of the bonding surfaces, which occurs in-plane on a bonding layer in a desolvation process of a preliminary drying step, is reduced, thereby ensuring that the bonding surfaces do not detach even if repeatedly exposed to heat shock after bonding. This bonding material, which solves the aforementioned problem, is characterized by being covered by organic matter with a carbon number of six or less, comprising main silver particles, and covered by organic matter with a carbon number of six or less, comprising nano silver particles having an average primary particle size of 10 to 30 nm, and sub silver particles. The bonding material is further characterized by containing nano silver particles with an average primary diameter of 100 to 200 nm, two types of solvents with different boiling points, and a dispersant.

Description

technical field [0001] The present invention relates to a joining material and a joining method using the same, particularly a joining method using nano silver particles for intermetallic joining. Background technique [0002] It is known that when the particle size of a metal becomes finer, physical properties specific to the size are exhibited. In particular, when nanoscale particles are formed, they sometimes show characteristics different from those of bulk materials. Utilizing this property, a joining material between different substances using nano metal ions is proposed. [0003] On the other hand, as automobiles and industrial equipment are electronically controlled, power consumption increases. Therefore, the operating temperature of semiconductors used therein tends to reach high temperatures. Therefore, there is an urgent need for a joining material that can withstand the environment at such a high temperature. In the past, lead-containing solder, which mainta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02B22F1/00B22F1/052B22F1/054B22F1/102
CPCB23K35/3006B23K1/203B22F1/0018B23K35/365B22F1/0062B22F3/1021B22F1/054B22F1/052B22F1/102B22F1/056
Inventor 远藤圭一栗田哲永冈实奈美
Owner DOWA ELECTRONICS MATERIALS CO LTD
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