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Halogen-free flame-retardant environment-friendly epoxy electronic encapsulating material

An environmentally friendly and encapsulating material technology, which is applied in the field of new electronic chemical materials, halogen-free flame-retardant and environmentally friendly epoxy electronic encapsulating materials, can solve the problems of low heat resistance and breakdown strength, which affect the quality and export of electronic products , low flame retardancy and other issues, to achieve excellent flame retardancy, good flame retardancy, and good temperature shock resistance

Inactive Publication Date: 2014-10-01
XIANYANG WEIHUA INSULATION MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The epoxy electronic packaging materials currently produced in China contain toxic and harmful substances such as halogens and antimony elements, which do not meet the EU's restrictions on halogens and the prohibition requirements of the International Electrotechnical Commission (IEC) and the International Electronics Industry Connection Council (IPC) , and low heat and humidity resistance and breakdown strength, low flame retardancy, affecting the quality and export of electronic products

Method used

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  • Halogen-free flame-retardant environment-friendly epoxy electronic encapsulating material
  • Halogen-free flame-retardant environment-friendly epoxy electronic encapsulating material
  • Halogen-free flame-retardant environment-friendly epoxy electronic encapsulating material

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Embodiment Construction

[0015] Halogen-free flame-retardant and environment-friendly epoxy electronic encapsulation material is mainly composed of epoxy resin, silica powder, curing agent, 2-methylimidazole, halogen-free flame retardant, leveling agent, pigment, copper oxalate eight kinds of substances mixed, It is a thermosetting powder electronic encapsulation compound made by kneading and extruding, cooling and pressing, crushing and grading, remixing and sieving. Wherein the percentage by weight of various main substances is: epoxy resin: silicon micropowder: curing agent: 2-methylimidazole: halogen-free flame retardant: leveling agent: pigment: copper oxalate=40-43: 40-42: 5 :0.2:3-4:1:2:2.8.

[0016] Yueyang Petrochemical CYD-014U was selected as the epoxy resin, DHG600 mesh was selected as the silicon powder, and Xi'an Dahe PSG-02 was selected as the curing agent.

[0017] The production method of the halogen-free flame-retardant and environment-friendly epoxy electronic encapsulation compoun...

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Abstract

The invention provides a halogen-free flame-retardant environment-friendly epoxy electronic encapsulating material. The encapsulating material mainly comprises epoxy resin, microsilica, a curing agent, 2-methylimidazole, a halogen-free flame retardant, a leveling agent, a pigment and cupric oxalate in a weight ratio of 40-43:40-42:5:0.2:3-4:1:2:2.8. The encapsulating material has characteristics of good flame retardance, moisture proofness and laser developing effects. The encapsulating material is free of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and polybromodiphenyl ether which are the six toxic and harmful compounds forbidden by directives of the European Union, and meets the newest international halogen-free antimony-free environment protection requirements of the European Union, the International Electrotechnical Commission and the Interconnecting and Packaging Electronic Circuits. The encapsulating material has excellent flame retardance, electric properties, mechanical properties, resistance to temperature shock, and good process using properties, plays roles of moisture proofness, insulation, mechanical protection, and the like, and reaches the level of similar products at abroad.

Description

technical field [0001] The invention relates to an epoxy electronic encapsulation material, in particular to a halogen-free flame-retardant and environment-friendly epoxy electronic encapsulation material, which belongs to new materials of electronic chemicals and is mainly used for encapsulating ceramic capacitors, film capacitors, monolithic capacitors, Electronic components such as varistors, thermistors, resistor networks, ceramic filters, thick film circuits, etc. Background technique [0002] The epoxy electronic packaging materials currently produced in China contain toxic and harmful substances such as halogens and antimony elements, which do not meet the EU's restrictions on halogens and the prohibition requirements of the International Electrotechnical Commission (IEC) and the International Electronics Industry Connection Council (IPC) , and low heat and humidity resistance and breakdown strength, low flame retardancy, affecting the quality and export of electronic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K13/02C08K3/02C08K5/098
Inventor 刘念杰徐文辉苏小军吴先锋
Owner XIANYANG WEIHUA INSULATION MATERIALS
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