Halogen-free flame-retardant environment-friendly epoxy electronic encapsulating material

Abstract

The invention provides a halogen-free flame-retardant environment-friendly epoxy electronic encapsulating material. The encapsulating material mainly comprises epoxy resin, microsilica, a curing agent, 2-methylimidazole, a halogen-free flame retardant, a leveling agent, a pigment and cupric oxalate in a weight ratio of 40-43:40-42:5:0.2:3-4:1:2:2.8. The encapsulating material has characteristics of good flame retardance, moisture proofness and laser developing effects. The encapsulating material is free of lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls and polybromodiphenyl ether which are the six toxic and harmful compounds forbidden by directives of the European Union, and meets the newest international halogen-free antimony-free environment protection requirements of the European Union, the International Electrotechnical Commission and the Interconnecting and Packaging Electronic Circuits. The encapsulating material has excellent flame retardance, electric properties, mechanical properties, resistance to temperature shock, and good process using properties, plays roles of moisture proofness, insulation, mechanical protection, and the like, and reaches the level of similar products at abroad.

Description

technical field [0001] The invention relates to an epoxy electronic encapsulation material, in particular to a halogen-free flame-retardant and environment-friendly epoxy electronic encapsulation material, which belongs to new materials of electronic chemicals and is mainly used for encapsulating ceramic capacitors, film capacitors, monolithic capacitors, Electronic components such as varistors, thermistors, resistor networks, ceramic filters, thick film circuits, etc. Background technique [0002] The epoxy electronic packaging materials currently produced in China contain toxic and harmful substances such as halogens and antimony elements, which do not meet the EU's restrictions on halogens and the prohibition requirements of the International Electrotechnical Commission (IEC) and the International Electronics Industry Connection Council (IPC) , and low heat and humidity resistance and breakdown strength, low flame retardancy, affecting the quality and export of electronic...

AI Technical Summary

Problems solved by technology

[0002] The epoxy electronic packaging materials currently produced in China contain toxic and harmful substances such as halogens and antimony elements, which do not meet the EU's restrictions on halogens and the prohibition requirements of the International Electrotechnical Commission (IEC) and the International Electronics Industry Connection Council (IPC) , and low heat and humidity resistance and breakdown strength, low flame retardancy, affecting the quality and export of electronic products

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