Three-dimensional integrated front-face wind-feeling heat type wind speed and direction sensor device and packaging method

Abstract

The invention discloses a three-dimensional integrated front-face wind-feeling heat type wind speed and direction sensor device and a packaging method. The device comprises a heat type wind speed and direction sensor in a front-face wind-feeling mode, a CMOS circuit chip and a printed circuit substrate. The heat type wind speed and direction sensor comprises a low-heat-conductivity substrate (with heat conductivity lower than 1W/m K). A heating element, a temperature measurement element and a bonding pad are arranged on the front face of the substrate, a passivation protection layer is deposited on the front face of the substrate to achieve front-face wind feeling, and the heating element, the temperature measurement element and the bonding pad are sealed with the passivation protection layer. The CMOS circuit chip is arranged between the back face of the substrate and the printed circuit substrate, a through hole corresponding to the bonding pad in position is formed in the substrate and the CMOS circuit chip, the through hole is filled with a metal substance, and the two ends of the metal substance are connected with the welding points on the bonding pad and the printed circuit substrate respectively. The packaging structure and method can obtain high reliability and the high integration level.

Description

technical field [0001] The invention relates to a low-power consumption and high-sensitivity thermal wind speed and direction sensor device and a packaging method based on three-dimensional integrated frontal wind sensing. The thermal wind speed sensor processed with a low thermal conductivity substrate is used for assembly. Background technique [0002] The thermal wind speed and direction sensor system is widely used in the measurement of wind speed and wind direction. With the gradual increase of natural disasters at home and abroad in recent years, the requirements for meteorological monitoring are getting higher and higher, so the thermal wind speed with low power consumption and high sensitivity can be realized. The wind direction sensor system is of great significance. In the thermal wind speed and direction sensor systems reported so far, two methods are generally used to realize the packaging of the sensor chip: the first is to use thermal conductive adhesive to bon...

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Problems solved by technology

But these two methods have their own shortcomings. Although the first packaging method can better protect the sensor structure, its sensitivity is not as high as that of the wind speed and direction sensor with frontal wind sensing.

On the other hand, the frontal wind sensing sensor systems all use bonding wires as the electrical connection between the sensor and the circuit board. The existence of bonding wires will affect the airflow distribution on the surface of the wind speed sensor to a certain extent, making the measurement results error; at the same time, because of the need for wind sensing, the bonding wire is directly exposed to the air, affected by the temperature and humidity in the environment, it is prone to short circuit or open circuit, so that the wind speed sensor cannot work normally

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