Fabrication method of microneedle array based on high voltage electric field

A technology of microneedle array and manufacturing method, which is applied in the direction of pharmaceutical devices and other medical devices, can solve the problems of unclear biocompatibility, complicated processing process, high cost, etc., and achieve simple and easy-to-operate manufacturing methods, and realize direct The effect of transmission and production cost reduction

Active Publication Date: 2016-03-23
SUN YAT SEN UNIV
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high cost of synchronous X-rays and the long production cycle, the cost of making microneedles with LIGA technology is very high, and the process is complicated and difficult to control.
[0006] The early microneedles mainly used silicon as the material. Due to the defects of low mechanical strength, high brittleness, easy fracture, unclear biocompatibility with the human body, and high processing costs, the conditions and conditions for promotion are not available at this stage. potential
In addition to significant advantages in physical and mechanical properties and mechanical properties, metal microneedles still have certain deficiencies in biocompatibility, and the processing process is relatively complicated. The obtained metal microneedles have certain difficulties in drug loading and drug release. , the effect is not necessarily ideal

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Fabrication method of microneedle array based on high voltage electric field
  • Fabrication method of microneedle array based on high voltage electric field
  • Fabrication method of microneedle array based on high voltage electric field

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] like Figure 1 to Figure 4 Shown is the first embodiment of the manufacturing method of the microneedle array based on the high-voltage electric field of the present invention, as Figure 4 As shown, the fabrication equipment based on the microneedle array includes a base mold 1, a hole mold 2 with several small holes, an electric field generating device 3 for generating a high-voltage electric field, and a bolus injector for injecting the base mixture solution into the base mold 1. Device 4, the injection device 4 is connected with the base mold 1, and the method for making the microneedle array includes the following steps:

[0033] a. making base mixture solution, said base mixture solution is mixed by epoxy resin, epoxy resin curing agent, the medicine that needs to be injected, and the base mixture solution that has been mixed uniformly is contained in the injection device 4;

[0034] b. The hole mold 2 is placed on the upper surface of the base mold 1, and the in...

Embodiment 2

[0052] like Figure 5 Shown is the second embodiment of the manufacturing method of the microneedle array based on the high-voltage electric field of the present invention. This embodiment is similar to Embodiment 1, the difference is that in this embodiment, a small hole with an aperture of 0.5 mm is selected, and the hole The distance is 30mm, and 35 small holes are evenly distributed on the hole die 2, 7 on the long side and 5 on the short side. In this embodiment, no heating source is added to the base mold 1, and the microneedle array structure is directly air-dried and solidified, which can save costs.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention relates to the technical field of biomedical engineering, in particular to a high voltage electric field-based manufacturing method for a microneedle array. The speed, flowing into a substrate die, of a substrate mixture solution is controlled by arranging a push injection device, and the substrate mixture solution is uniformly distributed on the substrate die, and is prevented from being accumulated; the substrate mixture solution is enabled to form a taylor cone, namely a microneedle array structure, on a hole die by using the mutual action between the electric field generated by an electric field generation device and the substrate mixture solution through controlling the voltage size, the manufacturing cost of the micronedle array structure is reduced, and the manufacturing method of the micronedle technology is simple and easy to operate.

Description

technical field [0001] The present invention relates to the technical field of a biomedical engineering method, and more specifically, to a method for manufacturing a microneedle array based on a high-voltage electric field. Background technique [0002] In the field of medical treatment, although biotechnology has produced many mature and effective drugs, the delivery of many drugs is subject to some restrictions, the most obvious being the oral administration of drugs and the injection of drugs. [0003] The main problem with oral administration is the degradation of the drug in the gastrointestinal tract and the excretion of the drug through the liver. Another commonly used way of administration is through intravenous injection. This method is not easy to use in non-medical places, and it is not easy to maintain and control the release of drugs, and it is inconvenient and painful for patients. Delivery of drugs through the skin is an attractive new approach, but this app...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): A61M37/00
Inventor 蒋乐伦黄伟龙陈珂云潘程枫凌金田陈志鹏
Owner SUN YAT SEN UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products