Flexible hot mask flow sensor with SiNx encapsulation protection layer and preparation method thereof

Abstract

The invention discloses a flexible hot mask flow sensor with a SiNx encapsulation protection layer and a preparation method thereof. The flexible hot mask flow sensor with the SiNx encapsulation protection layer comprises a Cr transition layer, a Ni sensitivity layer and the SiNx encapsulation protection layer, which are sequentially deposited on a polyimide substrate. The preparation method of the flexible hot mask flow sensor with the SiNx encapsulation protection layer includes: using an ion beam auxiliary depositing method to sequentially deposit the Cr transition layer, the Ni sensitivity layer and the SiNx encapsulation protection layer on the polyimide substrate, and then obtaining the flexible hot mask flow sensor with the SiNx encapsulation protection layer. The flexible hot mask flow sensor with the SiNx encapsulation protection layer and the preparation method thereof have the advantages that 1) the SiNx encapsulation protection layer can restrain erosion and oxidation from moisture and oxygen to flexible devices, and performance stability and use life of the flexible hot mask flow sensor are obviously improved; 2) the sensitivity layer and the encapsulation protection layer are continuously prepared on the flexible substrate, and the defects that the inner combination strength and the inner integration level of the flexible hot mask flow sensor are low, caused by using various preparation methods to complete preparation of the flexible hot mask flow sensor, are avoided; 3) the SiNx encapsulation protection layer improves sensitivity of the flexible hot mask flow sensor.

Description

technical field [0001] The present invention relates to a device with SiN x The invention relates to a flexible hot-film flow velocity sensor with a packaged protective layer and a preparation method thereof, which belong to the packaging field of hot-film flow velocity sensors. Background technique [0002] With the rapid development of microelectronic integrated circuit technology, the packaging material and manufacturing process of sensor devices have become one of the important factors affecting the reliability and stability of its application. [0003] Depositing a metal Ni film layer on a polyimide substrate has been widely used as a sensitive element of a thermal flow sensor (Sensors2009, 9, 9533). Organic materials such as polyimide (IEEE Electron Device Letter 1988, 9, 598), parylene (Sensors and Actuators A2005, 120, 101) and polyurethane (Progress in Natural Science 2008, 18, 197) have light weight, small size, and are suitable for automated production. And othe...

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Problems solved by technology

[0005] (1) Poor sealing of the encapsulation layer

Using organic materials such as polyimide as the encapsulation layer will cause the intrusion of water vapor and oxygen to cause the sensitive elements of the sensor to be corroded or oxidized

[0006] (2) The materials used in the encapsulation layer are expensive

Inert or corrosion-resistant metal materials such as Pt are expensive and not suitable for industrial applications

[0007] (3) The preparation method is complicated

The Ni hot film flow rate sensor is completed by a variety of preparation methods, resulting in low bonding strength between the sensor sensitive element and the packaging protective layer

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