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Insulating adhesive composition for metal-based copper clad laminate (MCCL), coated metal plate using same, and method for manufacturing same

An adhesive and composition technology, which is applied in the manufacture of metal core circuits, adhesive types, polymer adhesive additives, etc. The effect of using the path

Inactive Publication Date: 2014-11-12
POHANG IRON & STEEL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The first method has the disadvantages of ease of operation and reduced productivity because it is used in the form of laminated sheets, while the second method is the most commonly used general manufacturing method

Method used

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  • Insulating adhesive composition for metal-based copper clad laminate (MCCL), coated metal plate using same, and method for manufacturing same
  • Insulating adhesive composition for metal-based copper clad laminate (MCCL), coated metal plate using same, and method for manufacturing same
  • Insulating adhesive composition for metal-based copper clad laminate (MCCL), coated metal plate using same, and method for manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091] 1. Manufacture of the main ingredient

[0092] 20 g of KSR-177 (difunctional silane-modified epoxy resin, manufactured and sold by Kokudo Chemical Co., Ltd., epoxy equivalent 201 g / eq, viscosity 13,100 cps 25° C.), 10 g of YD-128 (bifunctional bisphenol A ring Oxygen resin, manufactured and sold by Kokudo Chemical Co., Ltd., equivalent weight 186g / eq, viscosity 12,800cps25°C), 10g of YDPN-638 (phenol novolac epoxy resin, manufactured and sold by Kokudo Chemical Co., Ltd.), and 60g of YP-50 ( Bisphenol A type phenoxy resin, manufactured and sold by Nippon Steel Chemical Co., Ltd., weight average molecular weight 65,000 g / mol) is completely dissolved in 60 g of methyl ethyl ketone and 60 g of propylene glycol methyl ether to produce the main ingredient part. At this time, the average molecular weight of the main ingredient part was 39,000 g / eq.

[0093] 2. Manufacture of master batch

[0094] In a basket ball mill (Basket mill), all the main components produced, 150 g ...

Embodiment 2

[0109] With 10g of KSR-276 (bifunctional silane-modified solid epoxy resin, manufactured and sold by Kokudo Chemical Co., Ltd., epoxy equivalent 430g / eq, softening point 63°C), 10g of YD-011 (bifunctional bisphenol A type Epoxy resin, manufactured and sold by Kokudo Chemical Co., Ltd., epoxy equivalent 450g / eq, softening point 65°C), 20g of YDPN-638, and 60g of YP-50 were completely dissolved in 60g of methyl ethyl ketone and 60g of Propylene glycol monomethyl ether, thereby producing the main agent part. At this time, the average molecular weight of the main ingredient part was 41,000 g / eq. The rest of the methods were under the same conditions as in Example 1 to manufacture and evaluate MCCL.

Embodiment 3

[0111] With 10g of KSR-177, 40g of YSLV-50TE (thiobisphenol type crystalline epoxy resin, manufactured and sold by Nippon Steel Chemical Co., Ltd., epoxy equivalent 175g / eq, melting point 46°C), and 60g of YP-70 (bisphenol A / F type phenoxy resin, manufactured and sold by Nippon Steel Chemical Co., Ltd., weight average molecular weight 55,000 g / mol) was completely dissolved in 60 g of methyl ethyl ketone and 60 g of propylene glycol monomethyl ether, thereby producing the main agent part. At this time, the average molecular weight of the main ingredient part was 31,500 g / eq. The rest of the methods were under the same conditions as in Example 1 to manufacture and evaluate MCCL.

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Abstract

The present invention relates to an insulating adhesive composition for metal printed circuit board, an adhesive-coated metal plate using the same, and a method for manufacturing the adhesive-coated metal plate. The adhesive composition according to the present invention forms an adhesive layer that is excellent in terms of adhesion to a copper foil, electrical insulating properties, and thermal resistance. The composition contains a specific epoxy resin, a curing agent and alumina. According to the present invention, in coating the metal plate with the solvent type adhesive, a roll coating method is used to perform a continuous coating process on the metal plate, thereby improving productivity when compared to the general method using a sheet type adhesive film.

Description

technical field [0001] The present invention relates to an insulating adhesive composition for MCCL (Metal Copper Clad Laminate, metal copper-clad laminate), a metal plate coated with the adhesive, and a method for manufacturing the coated metal plate. Background technique [0002] Printed Circuit Board (Printed Circuit Board) can be divided into resin system and metal system according to the type of substrate. Circuit substrate conversions are proliferating. Metal printed circuit boards are used for lighting and industrial purposes, such as LED substrates (replacement bulbs, fluorescent lamps, street lights, advertising lights), LED TVs, converters, inverters, and power supply devices (SMPS) , rectifier (rectifier), etc. [0003] Generally, metal printed circuit boards are made of metal plates such as aluminum, magnesium, molten aluminum-coated steel sheets, molten aluminum-zinc alloy coated steel sheets, molten zinc-coated steel sheets, and zinc-plated steel sheets; insu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04C09J7/00C23C26/00
CPCC23C28/30C09J163/00C09J7/00C23C26/00C09J11/04H05K3/386C08G59/1433C08G59/145Y10T428/263Y10T428/2804C09J11/06C09J11/08C09J7/28C08K2003/2227C08K2201/005C09J163/10H05K1/056H05K3/44
Inventor 朴赞燮赵来弘金东炫朴景浩韩相权朴锺洙李培根金重凤韩在满申泰圭裴大喆
Owner POHANG IRON & STEEL CO LTD