Insulating adhesive composition for metal-based copper clad laminate (MCCL), coated metal plate using same, and method for manufacturing same
An adhesive and composition technology, which is applied in the manufacture of metal core circuits, adhesive types, polymer adhesive additives, etc. The effect of using the path
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Embodiment 1
[0091] 1. Manufacture of the main ingredient
[0092] 20 g of KSR-177 (difunctional silane-modified epoxy resin, manufactured and sold by Kokudo Chemical Co., Ltd., epoxy equivalent 201 g / eq, viscosity 13,100 cps 25° C.), 10 g of YD-128 (bifunctional bisphenol A ring Oxygen resin, manufactured and sold by Kokudo Chemical Co., Ltd., equivalent weight 186g / eq, viscosity 12,800cps25°C), 10g of YDPN-638 (phenol novolac epoxy resin, manufactured and sold by Kokudo Chemical Co., Ltd.), and 60g of YP-50 ( Bisphenol A type phenoxy resin, manufactured and sold by Nippon Steel Chemical Co., Ltd., weight average molecular weight 65,000 g / mol) is completely dissolved in 60 g of methyl ethyl ketone and 60 g of propylene glycol methyl ether to produce the main ingredient part. At this time, the average molecular weight of the main ingredient part was 39,000 g / eq.
[0093] 2. Manufacture of master batch
[0094] In a basket ball mill (Basket mill), all the main components produced, 150 g ...
Embodiment 2
[0109] With 10g of KSR-276 (bifunctional silane-modified solid epoxy resin, manufactured and sold by Kokudo Chemical Co., Ltd., epoxy equivalent 430g / eq, softening point 63°C), 10g of YD-011 (bifunctional bisphenol A type Epoxy resin, manufactured and sold by Kokudo Chemical Co., Ltd., epoxy equivalent 450g / eq, softening point 65°C), 20g of YDPN-638, and 60g of YP-50 were completely dissolved in 60g of methyl ethyl ketone and 60g of Propylene glycol monomethyl ether, thereby producing the main agent part. At this time, the average molecular weight of the main ingredient part was 41,000 g / eq. The rest of the methods were under the same conditions as in Example 1 to manufacture and evaluate MCCL.
Embodiment 3
[0111] With 10g of KSR-177, 40g of YSLV-50TE (thiobisphenol type crystalline epoxy resin, manufactured and sold by Nippon Steel Chemical Co., Ltd., epoxy equivalent 175g / eq, melting point 46°C), and 60g of YP-70 (bisphenol A / F type phenoxy resin, manufactured and sold by Nippon Steel Chemical Co., Ltd., weight average molecular weight 55,000 g / mol) was completely dissolved in 60 g of methyl ethyl ketone and 60 g of propylene glycol monomethyl ether, thereby producing the main agent part. At this time, the average molecular weight of the main ingredient part was 31,500 g / eq. The rest of the methods were under the same conditions as in Example 1 to manufacture and evaluate MCCL.
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