Micro-pore polishing equipment and micro-pore polishing process for abrasive particle flow

Abstract

The invention discloses micro-pore polishing equipment for an abrasive particle flow. The micro-pore polishing equipment comprises a clamp, a base plate, a through-hole-shaped cavitation cavity, a high-transparency laser protection lens, a laser device, a focusing lens and an abrasive material guide channel, wherein the clamp is used for clamping a workpiece and positioning a micro-pore to be polished in the workpiece; the base plate is mounted on the clamp; the cavitation cavity is arranged on the base plate and is correspondingly communicated with the micro-pore in the workpiece; the high-transparency laser protection lens covers one side, opposite to the workpiece, of the cavitation cavity; the laser device can generate a laser beam towards the cavitation cavity; the focusing lens is arranged between the laser device and the high-transparency laser protection lens and can be used for focusing the laser beam into the cavitation cavity; the abrasive material guide channel can be used for leading pressure abrasive particle fluid into the cavitation cavity. By adopting the micro-pore polishing equipment, laser is continuously and periodically focused on the fluid to form cavitation; generated great partial pressure and a jet flow for pushing the abrasive particle flow to the micro-pore are used for continuously pushing the abrasive particle flow to flow in the micro-pore at a high speed and abrade the pore wall of the micro-pore, so that the super-precision and high-efficiency polishing is carried out on the micro-pore. The invention further discloses a micro-pore polishing process for the abrasive particle flow. By using the method disclosed by the invention, the super-precision and high-efficiency polishing can be carried out on the micro-pore.

Description

technical field [0001] The invention relates to precision machining, in particular to an abrasive particle flow microhole polishing device for polishing the inner surface of micropores of metal or nonmetallic hard and brittle materials. The invention also relates to an abrasive flow micropore polishing process for polishing micropores. Background technique [0002] Various micropores are more and more widely used in industries such as aircraft, automobiles, electrical appliances, chemicals, food, and biomedicine. Such as microholes on printed circuit boards, internal combustion engine fuel nozzles, chemical fiber filament nozzles, chopper holes on gold wire ball welding machines, etc. Among them, the minimum diameter of the spray hole of the chemical fiber nozzle is about 10 microns; the minimum diameter of the micropore of the gold wire ball welding machine is about 25 microns. At present, the roughness of the micropore inner surface of these products processed by convent...

AI Technical Summary

Problems solved by technology

If the pressure range of conventional abrasive flow equipment is 0.7MPa-22.4MPa, the abrasive flow polishing pressure of 50um holes needs to reach 12.8MPa-411.1MPa, and if it is to polish 30um holes, it will reach 31MPa-995MPa, such a larg

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