Organic silicon composition with main chain containing phenylene structure and preparation method thereof

A silicone and composition technology, which is applied in the field of silicone compositions containing phenylene structure in the main chain and its preparation, can solve the problems of poor compatibility, cracks, whitening resin, etc., and achieve strong bonding performance and high hardness , Strong tensile strength effect

Active Publication Date: 2014-11-19
江苏矽时代材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the introduction of too many epoxy groups will lead to poor compatibility, wh

Method used

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  • Organic silicon composition with main chain containing phenylene structure and preparation method thereof

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Effect test

Embodiment 1

[0077] The preparation of embodiment 1 A1 component

[0078] (1) Add 150g (0.53mol) of 1,4-bis(dimethylethoxysilyl)benzene, phenyl trimethyl Oxysilane 500g (2.53mol), methylphenyldimethoxysilane 50g (0.27mol), 5-dichloromethylsilylbicyclo[2.2.1]-hept-2-ene 40g (0.19mol) , Vinyldimethylmethoxysilane 44g (0.38mol) and toluene 1000g, stir well and raise the temperature to 60°C;

[0079] (2) At 60°C, add 600g of a mixture of KOH and water dropwise, and the dropping time is controlled within 1 hour;

[0080] (3) After the dropwise addition, the temperature was raised and refluxed for 4 hours;

[0081] (4) Separate the water layer, and wash the polymer and solvent part with water until neutral;

[0082] (5) After removing unreacted raw materials and solvent, the target product A1 component is obtained.

Embodiment 2

[0083] The preparation of embodiment 2 A2 component

[0084] (1) Add 100g (0.35mol) of 1,4-bis(dimethylethoxysilyl)benzene, phenyl trimethyl Oxysilane 500g (2.53mol), phenylmethyldimethoxysilane 80g (0.44mol), vinylmethyldimethoxysilane 15g (0.11mol), vinyldimethylmethoxysilane 44g ( 0.38mol) and toluene 1000g, stir well and heat up to 60°C;

[0085] (2) At 60°C, add 600g of a mixture of KOH and water dropwise, and the dropping time is controlled within 1 hour;

[0086] (3) After the dropwise addition, the temperature was raised and refluxed for 4 hours;

[0087] (4) Separate the water layer, and wash the polymer and solvent part with water until neutral;

[0088] (5) After removing unreacted raw materials and solvents, the target product A2 component is obtained.

Embodiment 3

[0089] The preparation of embodiment 3 B1 component

[0090] (1) Add 100g (0.35mol) of 1,4-bis(dimethylethoxysilyl)benzene, diphenyl Dimethoxysilane 280g (1.15mol), dimethyldimethoxysilane 80g (0.67mol), dihydrotetramethyldisiloxane 28g (0.21mol) and toluene 1000g, stir well and heat it up to 80°C;

[0091] (2) At 80°C, add 500 g of the mixture of HCl and water dropwise, and the dropping time is controlled within 1 hour;

[0092] (3) After the dropwise addition, the temperature was raised and refluxed for 5 hours;

[0093] (4) Separate the water layer, and wash the polymer and solvent part with water until neutral;

[0094] (5) After removing unreacted raw materials and solvent, the target product B1 component is obtained.

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Abstract

The invention provides an organic silicon composition with a main chain containing a phenylene structure. The organic silicon composition is composed of four parts A, B, C and D; each compound of the part (A) contains at least three C-C double bonds, and the structural formula of the part (A) is shown in a general formula (1) which is as shown in the specification, wherein each R is independently a monovalent alkyl or alkoxy with 1-12 carbon atoms, and a, b and c are selected from positive integers between 1 and 20; and the part (B) is a phenylene-structure-containing main chain with two Si-H base heads and straight-chain siloxane with side-group phenyl, and the structural formula of the part (B) is shown in a general formula (2) which is as shown in the specification. The organic silicon composition provided by the invention is high in hardness of cured substances and strong in tensile strength, has no peel-off phenomenon after being subjected to hot and cold impact for multiple times, is heat-resistant and strong in adhesive property, and can be used as a packaging material for various optical components.

Description

technical field [0001] The invention relates to the field of organosilicon, in particular to an organosilicon composition with a main chain containing a phenylene structure and a preparation method thereof. Background technique [0002] As a new type of green light source product, LED has the characteristics of high light transmittance, good thermal stability, low stress, and low moisture absorption, which is obviously superior to traditional epoxy resin, and is widely used in high-power LED packaging. However, recently, short-wavelength LEDs such as blue LEDs and ultraviolet LEDs have been developed, and conventional epoxy and silicone resins have problems of resin yellowing when used in the above-mentioned LED packages. [0003] Although silicone resin materials have excellent heat resistance and light resistance, these high-hardness silicone resins often have poor adhesion. , The silicone resin has a phenomenon of detachment from the device. To improve adhesion and ...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/05C08G77/20C08G77/12H01L33/56
Inventor 康润华
Owner 江苏矽时代材料科技有限公司
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