Highly-integrated electromagnetic bistable-state MEMS relay and manufacturing method of highly-integrated electromagnetic bistable-state MEMS relay

A highly integrated, bistable technology, applied in the direction of electrostatic relays/electro-adhesion relays, relays, circuits, etc., can solve the complex preparation method of three-dimensional solenoid coils, the number of turns of single-chip manufacturing coils, and the high cost of LIGA technology, etc. problem, to achieve the effect of shortening the process cycle, improving overall performance, and small size

Active Publication Date: 2014-12-03
SHANGHAI UNIV OF ENG SCI
View PDF6 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the preparation method of the three-dimensional solenoid coil is complicated, and the cost of LIGA technology is high, the efficiency is low, and the number of coil turns contained in the single-chip manufacturing coil is relatively small due to the limitation of the external size.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Highly-integrated electromagnetic bistable-state MEMS relay and manufacturing method of highly-integrated electromagnetic bistable-state MEMS relay
  • Highly-integrated electromagnetic bistable-state MEMS relay and manufacturing method of highly-integrated electromagnetic bistable-state MEMS relay
  • Highly-integrated electromagnetic bistable-state MEMS relay and manufacturing method of highly-integrated electromagnetic bistable-state MEMS relay

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0044] like figure 1 As shown, a highly integrated electromagnetic bistable MEMS relay provided by the present invention includes: a substrate 10 and an electromagnetic drive system 20 integrated on the substrate 10, an elastic support system 30, a signal switching system 40 and a permanent magnet 50 , the permanent magnet 50 is located above the elastic support system 30 .

[0045] like figure 2 As shown, the electromagnetic drive system 20 includes a multi-turn spiral planar coil 21 and a closed yoke 22, the closed yoke 22 is distributed in the center, bottom and edge of the planar coil 21; an insulating layer is arranged between the coils; the planar coil The shape of the planar coil 21 can be square, rectangular or circular, and it is square in this embodiment; the planar coil 21 is preferably a single-layer coil, the thickness of the coil is preferably 22-26 μm, and the width is preferably 12-15 μm.

[0046] like image 3 As shown, the elastic support system 30 includ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a highly-integrated electromagnetic bistable-state MEMS relay and a manufacturing method of the highly-integrated electromagnetic bistable-state MEMS relay. The relay is an MEMS device which is characterized in that all relay systems for electromagnetic driving, elastic supporting, signal switching and the like and a permanent magnet are integrated on a single substrate. The manufacturing method includes the steps of conducting seed layer sputtering, photoresist spin coating and insulating layer forming on the substrate, forming a planar coil, a closed magnet yoke, a cantilever beam, an elastic platform, a magnet yoke platform, a movable contact, a fixed contact, a signal line and a supporting structure through the photoetching process, the electroplating process and the like, forming air gaps with the release method, and installing the permanent magnet on the elastic platform to form the complete relay. All the systems of the electromagnetic bistable-state MEMS relay are integrated on the single substrate with the MEMS technology, the integration level is improved, the size of the relay is reduced, power dissipation of the relay is reduced, work reliability of the relay is guaranteed, the manufacturing technology is simplified, and the highly-integrated electromagnetic bistable-state MEMS relay and the manufacturing method are suitable for industrialization volume production.

Description

technical field [0001] The invention relates to a highly integrated electromagnetic bistable MEMS relay and a preparation method thereof, belonging to the technical field of micro-electronic machinery. Background technique [0002] A relay is a kind of "automatic switch" that controls the operation of a large current through a small current, and switches the circuit by automatically turning on / off. In the circuit, through remote control, the relay can be used to realize functions such as safety protection and circuit switching, and is widely used in power management, instrumentation, automatic control and communication connection and other fields. [0003] In today's relay market, communication relays have occupied more than 25% of the share. Communication relays are mainly used in networks, instrumentation, automatic control and other occasions where switching can be performed remotely or indirectly. With the development of information technology, communication has transf...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01H59/00
Inventor 苗晓丹
Owner SHANGHAI UNIV OF ENG SCI
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap