Highly-integrated electromagnetic bistable-state MEMS relay and manufacturing method of highly-integrated electromagnetic bistable-state MEMS relay
A highly integrated, bistable technology, applied in the direction of electrostatic relays/electro-adhesion relays, relays, circuits, etc., can solve the complex preparation method of three-dimensional solenoid coils, the number of turns of single-chip manufacturing coils, and the high cost of LIGA technology, etc. problem, to achieve the effect of shortening the process cycle, improving overall performance, and small size
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[0044] like figure 1 As shown, a highly integrated electromagnetic bistable MEMS relay provided by the present invention includes: a substrate 10 and an electromagnetic drive system 20 integrated on the substrate 10, an elastic support system 30, a signal switching system 40 and a permanent magnet 50 , the permanent magnet 50 is located above the elastic support system 30 .
[0045] like figure 2 As shown, the electromagnetic drive system 20 includes a multi-turn spiral planar coil 21 and a closed yoke 22, the closed yoke 22 is distributed in the center, bottom and edge of the planar coil 21; an insulating layer is arranged between the coils; the planar coil The shape of the planar coil 21 can be square, rectangular or circular, and it is square in this embodiment; the planar coil 21 is preferably a single-layer coil, the thickness of the coil is preferably 22-26 μm, and the width is preferably 12-15 μm.
[0046] like image 3 As shown, the elastic support system 30 includ...
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Abstract
Description
Claims
Application Information
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