Method for restoration of dielectric K value
A technology for repairing medium and K value, which is applied in the fields of electrical components, semiconductor/solid-state device manufacturing, circuits, etc. It can solve the problems of easily damaged media and achieve the effect of repairing K value
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Embodiment 1
[0039] see Figure 1 to Figure 5 , the present invention provides a method for repairing the K value of a medium, the method for repairing the K value of a medium at least comprises the following steps:
[0040] Step 1), first see figure 1 , a substrate 1 is provided, and a dielectric layer 2 is formed on the substrate 1;
[0041] Specifically, the substrate 1 may be a conventional semiconductor substrate such as Si, Ge, SOI, etc., or may be a laminated structure including some devices. The medium layer 2 is a low-K medium. In this embodiment, the medium layer 2 is preferably a porous ultra-low-K medium; the porous ultra-low-K medium satisfies Kfigure 1 A number of holes 3 in the dielectric layer 2 are shown in FIG. In this embodiment, the dielectric layer 2 is formed by chemical vapor deposition on the substrate 1 firstly to form a dielectric film layer, and then a number of holes 3 are formed in the dielectric film layer by porogen and ultraviolet light treatment. It shou...
Embodiment 2
[0055] Embodiment 2 adopts basically the same solution as Embodiment 1, except that in Embodiment 2, the step of irradiating the dielectric layer with microwaves is further included after the polishing process in the subsequent process flow.
[0056] see Figures 6 to 8 , the present invention provides a method for repairing the K value of a medium, the method for repairing the K value of a medium at least comprises the following steps:
[0057] Step 1), providing a substrate, and forming a dielectric layer on the substrate;
[0058] Step 2), etching a number of grooves in the dielectric layer, and cleaning to remove etching residues;
[0059] Step 3), using microwave to irradiate the etched dielectric layer.
[0060] It should be pointed out that the steps 1) to 3) in this embodiment are the same as the steps 1) to 3) in Figure 1 to Figure 5 and related text descriptions, which will not be repeated here.
[0061] Then proceed to step 4), see Image 6 , Fill metal 6 in t...
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