Rhinestone processing method and rhinestone automatic grinding and polishing system

Abstract

The invention discloses a rhinestone processing method and an automatic rhinestone polishing system. After an upper half ball is subjected to polishing processing and butting, a lower half ball needing to be subjected to top end face processing is firstly subjected to top end face grinding processing and conical surface grinding processing, so that the lower half ball of a rhinestone blank is processed to form a frustum; then a top end face and a slope are polished. According to the scheme, the lower half ball slope polishing processing speed is increased, and abrasion to a polishing grinder is reduced; meanwhile, all stations in the automatic polishing system is more reasonable in arrangement; the equipment utilization rate is higher, and the use cost is lowered.

Description

technical field [0001] The invention belongs to the field of grinding and polishing processing of crystal products, and in particular relates to a water diamond processing method and an automatic grinding and polishing system for automatic grinding and polishing of water diamond products. Background technique [0002] In the prior art, the automatic grinding and polishing system of the crystal blank (including the top surface grinding and polishing process) includes: a feeding station, which is provided with a feeding mechanism capable of fixing the crystal blank on the fixture; at least one pair of crystal blanks The upper hemisphere grinding station for grinding the upper hemisphere of the piece and at least one upper hemisphere polishing station for polishing the upper hemisphere of the crystal blank; A docking mechanism that is fixed on another fixture and can exchange the positions of the two fixtures; at least one lower hemisphere grinding station for grinding the lowe...

AI Technical Summary

Problems solved by technology

[0005] However, in the grinding and polishing process of rhinestone products, the grinding process is fast and the consumption of grinding abrasives is slow, while the polishing process is slow and the consumption of polishing abrasives is fast.

In the above-mentioned processing method, since the lower hemisphere bevel is ground and polished first, and then the top surface is ground and polished, the bevel polishing process takes longer, the polishing abrasives for bevel polishing are consumed faster, and the equipment use cost is higher.

Moreover, the process layout of the above-mentioned processing method will also lead to more complicated station layout of automatic grinding and polishing equipment, low equipment utilization rate and high use cost

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