A dual-mass decoupling silicon microgyroscope based on flexible connections

Abstract

The invention discloses a dual-mass decoupling silicon microgyroscope based on flexible connection. The dual-mass decoupling silicon microgyroscope comprises a base which is provided with an electric signal lead-out wire and a microgyroscope mechanical structural layer which is arranged on the base; the microgyroscope mechanical structural layer comprises a first substructure, a second substructure and a substructure connection device, and the first substructure is connected with the second substructure through the substructure connection device; two completely identical substructures are adopted to reduce the influence of the temperature and stress on the entire microgyroscope, the two substructures are symmetrically arranged on left and right sides, and the motion way of each substructure is linear motion in an x-y plane; by adopting the substructure connection device, the left substructure and the right substructure are integrated into a whole body, so that the consistency of the motion frequency of the two substructures can be guaranteed; moreover, the isolation of the drive motion from the detection motion can be guaranteed by adopting the substructure connection device, and the complete decoupling of the structural motion can be realized; the adoption of the substructure connection device ensures that drive parts and detection parts of the two substructure respectively make linear motion in opposite directions when the microgyroscope makes the drive motion and the detection motion.

Description

technical field [0001] The invention relates to a dual-mass decoupling silicon micro-gyroscope based on flexible connections, which belongs to the fields of micro-electronic machinery and micro-inertia measurement. Background technique [0002] Silicon micromachined gyroscope is a new type of gyroscope developed on the basis of microelectromechanical system technology. As the product of the combination of microelectronic planar processing technology and silicon micromachining technology, microelectromechanical system technology is the expansion and development of microelectronic technology. Extending, the sensor and detection unit are organically integrated, which not only inherits the characteristics of mass production of microelectronics technology, but also greatly reduces the size of the sensor. Silicon micromechanical gyroscopes are characterized by their small size, light weight and low power consumption , high integration, strong anti-overload ability and other advant...

AI Technical Summary

Problems solved by technology

Due to processing errors and structural design, capacitive vibration micromachined gyroscopes have disadvantages such as being easily affected by mechanical coupling and axial acceleration, low detection capacitance, and low sensitivity.

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