High power semiconductor laser of conduction cooling laminated array
A technology of conduction cooling and lasers, which is applied in the direction of semiconductor lasers, lasers, laser components, etc., can solve the problems of large packaging structure and poor system integration, and achieve the effect of improving heat dissipation performance and compact structure
Active Publication Date: 2015-01-07
FOCUSLIGHT TECH
View PDF6 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0008] The invention proposes a new conduction-cooled laminated array high-power semiconductor laser, which solves the problems of large volume and poor system integration of the existing packaging structure
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0037] Such as figure 1 Shown is the structural representation of the present invention, figure 2 It is a schematic disassembly diagram of the structure of the present invention. The conduction cooling type semiconductor laser of the present invention comprises a laser chipset 1 , a positive connection block 2 , a negative connection block 3 and a basic heat sink 6 .
[0038] The laser chip set 1 adopts a plurality of laser chips to form a stacked module, wherein each laser chip 12 has a substrate 13, that is, a single laser chip 12 is welded on the substrate 13 to form a module, and then a plurality of such modules are welded on the substrate in turn. together form a laser chipset such as image 3 Shown is the schematic diagram of the structure of the laser chipset of the present invention; the two end faces of the stacking direction of the stack module (ie, the laser chipset 1) are respectively used as the positive end and the negative end of the laser chipset 1, and the...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention provides a novel high power semiconductor laser of a conduction cooling laminated array. The problems that an existing packaging structure is large in size and poor in system integration are solved. In the high power semiconductor laser of the conduction cooling laminated array, the mounting position of a laser chipset corresponds to the middle of a heat sink, and a heat conduction insulation layer is arranged between the laser chipset and the heat sink. A positive electrode connecting block and a negative electrode connecting block are both of an L-shaped structure, and the positive electrode connecting block and the negative electrode connecting block are arranged in a central symmetry mode and are welded with the heat sink through the heat conduction insulation layer. In the L-shaped structures, long parts and short parts are connected in a reverse mode to form welding faces in different directions. The long part of the L-shaped structure of the positive electrode connecting block and the long part of the L-shaped structure of the negative electrode connecting block are attached and welded to the two end faces of a laminated array module respectively. The short part of the L-shaped structure of the positive electrode connecting block and the short part of the L-shaped structure of the negative electrode connecting block are in a hole plate type to be used as extraction electrodes, the mounting positions of the short parts correspond to two wings of the heat sink, and the short parts are welded with the heat sink through electrode insulation layers.
Description
technical field [0001] The invention relates to a conduction cooling lamination array high-power semiconductor laser, especially suitable for high-power semiconductor laser pumping solid-state lasers or direct lighting applications. Background technique [0002] Semiconductor lasers have the advantages of small size, light weight, high electro-optical conversion efficiency, high reliability and long life, and can be widely used in pumping solid-state and fiber lasers. These lasers can be used in laser information transmission, material processing, medical treatment and beauty, Scientific research, laser printing, military defense and laser entertainment display; it can also be directly applied to material surface treatment, laser night vision lighting system, laser hair removal and other fields after optical shaping. More and more applications require semiconductor lasers to have higher power density, longer life, higher stability and reliability, and longer storage time. H...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): H01S5/024
Inventor 王警卫宗恒军刘兴胜
Owner FOCUSLIGHT TECH