Packaging method of LED filament and LED filament

A technology of LED filament and packaging method, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of low yield rate and low light transmittance of brackets, and achieve improved yield rate, light output efficiency and uniformity of light output, The effect of reducing production costs

Inactive Publication Date: 2015-01-28
DONGGUAN INST OF OPTO ELECTRONICS PEKING UNIV +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a method for packaging LED filaments and LED filaments, which does not require a bracket for packaging, realizes packaging without brackets, and effectively solves the problems of low yield rate and low light transmittance of brackets

Method used

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  • Packaging method of LED filament and LED filament
  • Packaging method of LED filament and LED filament
  • Packaging method of LED filament and LED filament

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Embodiment Construction

[0022] In order to facilitate the understanding of those skilled in the art, the present invention will be further described below in conjunction with the accompanying drawings.

[0023] The invention discloses a method for packaging LED filaments. The method realizes packaging without a bracket, and does not need to use a bracket during the entire packaging process. Include the following steps:

[0024] Step 1: inject liquid silicone resin and phosphor powder mixture into the mold, and place metal conductive pins at one end of the silicone resin and phosphor powder mixture in the mold. Mixing and stirring the silicone resin and the fluorescent powder evenly and performing degassing treatment, so as to obtain the required liquid mixture of the silicone resin and the fluorescent powder. Air bubbles in the mixture are removed by defoaming treatment. There are two metal conductive pins to realize the current loop.

[0025] Step 2, removing the mold after heating and curing the...

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Abstract

The invention discloses a packaging method of an LED filament. The packaging method of the LED filament includes the steps that a liquid silicon resin and fluorescent powder mixture is injected into a mould, and a metal conductive pin is arranged at one end of the silicon resin and fluorescent powder mixture inside the mould; the mould is removed after being heated and solidified, and silicon resin and fluorescent powder colloid with the metal conductive pin at one end is obtained; a plurality of LED chips are installed on the silicon resin and fluorescent powder colloid, and the LED chips are mutually connected through a wire and then connected to the metal conductive pin to form a conductive path; the silicon resin and fluorescent powder colloid with the LED chips is put into the mould, and a liquid silicon resin and fluorescent powder mixture is injected into the mould to cover the LED chips and the wire; the mould is removed after being heated and solidified, and the packaged LED filament finished product with a supporting frame is obtained. The LED filament is packaged without the supporting frame, and the quality problems of low yield, low light transmittance of the supporting frame and the like are resolved.

Description

technical field [0001] The invention relates to the technical field of LED packaging, in particular to a supportless packaging method for LED filaments and an LED filament manufactured according to the packaging method. Background technique [0002] LED filaments are also called LED lampposts. In the past, LED light sources had to be equipped with optical devices such as lenses to achieve a certain illuminance and illumination area, which would affect the lighting effect and reduce the energy-saving effect of LEDs. The LED filament realizes 360° full-angle light emission through the packaging structure, large-angle light emission and no need for lenses, and realizes a three-dimensional light source. As early as 2008, Japan's Ushio Light Source launched a traditional incandescent lamp made of LED lamp beads, which attracted great attention in the industry and achieved mass production. Subsequently, candle lamps, crystal lamps, and bulb lamps with LED filaments as light sou...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/50H01L33/48H01L33/00
CPCH01L33/005H01L33/48H01L33/502H01L33/62H01L2933/0008H01L2933/0041
Inventor 陈建李顺峰郑小平
Owner DONGGUAN INST OF OPTO ELECTRONICS PEKING UNIV
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