Multi-layer power distribution network of high-frequency printed boards based on accessory resistive films

A technology of power division network and distribution network, which is applied in the direction of circuits, electrical components, printed circuit components, etc., and can solve problems such as low quality reliability, large volume and weight, poor signal amplitude and phase consistency performance, etc.

Inactive Publication Date: 2015-01-28
THE 41ST INST OF CHINA ELECTRONICS TECH GRP
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  • Abstract
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  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the need to open holes in this structure, the wiring layout between different layers will affect each other, so generally only one layer of power distribution network is buried in one layer of the printed board; at the same time, the through hole has an inductive effect. The index of high power divider is reduced, a

Method used

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  • Multi-layer power distribution network of high-frequency printed boards based on accessory resistive films

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Embodiment 1

[0015] The invention provides a multilayer power distribution network based on a high-frequency printed board with a resistive film, a multilayer power distribution network based on a copper clad board with a resistive film, and each layer of the multilayer power distribution network is set as a Stripline structure, the lower medium of the stripline structure is a core board, and the upper medium of the stripline structure is a prepreg; the multi-layer power distribution network is provided with ladder slots to lead out signal lines, so as to facilitate communication with other circuits Interconnection: use the printed board multi-layer mixed voltage process to integrate the power division network with other circuits.

[0016] In the above, the core plate is a high-frequency plate with a built-in resistive film and a small loss angle; the prepreg is a high-frequency plate with a small loss angle; the core plate and the prepreg have the same dielectric constant.

[0017] In the...

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Abstract

The invention provides a multi-layer power distribution network of high-frequency printed boards based on accessory resistive films. The multi-layer power distribution network of the copper-clad plates based on the accessory resistive films is formed by overlaying multiple layers of copper-clad plates, each layer of the multi-layer power distribution network is arranged to be of a strip line structure, lower-layer media of the strip line structures are core plates, and upper-layer media of the strip line structures are prepregs; stepped open grooves are formed in the multi-layer power distribution network to lead out signal lines so that the multi-layer power distribution network can be connected with other circuits conveniently; by utilizing a printed board multi-layer mixed pressing technology, the power distribution network and the other circuits are integrated through mixed pressing. By the adoption of the scheme, a lining plate and a shielding cavity are not needed, and the circuits are small in size and low in weight; isolating resistors are directly buried in the multiple layers of printed boards, punching is not needed, the isolating resistors are connected with a surface-layer resistor, different layers of the power distribution network are not affected mutually, and a power distribution network with more layers can be manufactured.

Description

technical field [0001] The invention belongs to the technical field of multi-layer power distribution of high-frequency printed boards, and in particular relates to a multi-layer power distribution network of high-frequency printed boards with resistance film attached. Background technique [0002] With the development of microwave and millimeter wave phased array radar technology and its wide application in ground, shipboard, airborne, and spaceborne radars, the importance of power division networks for signal power division and channel synthesis has become increasingly prominent. At present, a multi-channel power division of a row array is mainly realized through a planar structure with a metal lining, and then stacked and combined to form a power division network of multiple row arrays. If necessary, a group of power divisions of the array can be added at the common end. The internet. In the planar power distribution network, microstrip power distribution circuits and po...

Claims

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Application Information

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IPC IPC(8): H01P3/18H01P3/08H05K1/02
Inventor 李玉刚葛新灵王飞
Owner THE 41ST INST OF CHINA ELECTRONICS TECH GRP
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