A Multilayer Power Distribution Network Based on High Frequency Printed Board with Resistive Film

Abstract

The invention provides a multilayer power distribution network based on a high-frequency printed board with a resistive film. The multilayer power distribution network based on a copper clad laminate with a resistive film is a multilayer power distribution network formed by laminating multiple layers of copper clad laminates. Each layer of the multilayer power distribution network is set as a stripline structure, the lower medium of the stripline structure is a core board, and the upper medium of the stripline structure is a prepreg; the multilayer power distribution network Ladder grooves are set on the top to lead out the signal lines to facilitate interconnection with other circuits; the power distribution network is mixed and integrated with other circuits by using the printed board multi-layer mixed pressure process. With the above scheme, no liner is needed, and the shielding cavity circuit is small in size and light in weight; the isolation resistor is directly embedded in the multilayer printed board and does not need to be drilled to connect with the surface resistor, and the power distribution network of different layers does not affect each other. More layers of power division network can be done.

Description

technical field [0001] The invention belongs to the technical field of multi-layer power distribution of high-frequency printed boards, and in particular relates to a multi-layer power distribution network of high-frequency printed boards with resistance film attached. Background technique [0002] With the development of microwave and millimeter wave phased array radar technology and its wide application in ground, shipboard, airborne, and spaceborne radars, the importance of power division networks for signal power division and channel synthesis has become increasingly prominent. At present, a multi-channel power division of a row array is mainly realized through a planar structure with a metal lining, and then stacked and combined to form a power division network of multiple row arrays. If necessary, a group of power divisions of the array can be added at the common end. The internet. In the planar power distribution network, microstrip power distribution circuits and po...

AI Technical Summary

Problems solved by technology

Due to the need to open holes in this structure, the wiring layout between different layers will affect each other, so generally only one layer of power distribution network is buried in one layer of the printed board; at the same time, the through hole has an inductive effect. The index of high power divider is reduced, and the applicable frequency is lower

The existing stacked line array power distribution network structure has complex assembly, many assembly interconnection points, large assembly workload, poor channel consistency, low quality reliability, large volume and weight, high cost, and signal amplitude and phase consistency. bad

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