Packaging structure of photoelectric conversion chip for plastic optical fiber communication

Abstract

The invention provides an encapsulation structure for a photoelectric conversion chip for plastic optical fiber communication. The encapsulation structure comprises a casing, a luminous semiconductor base plate, an annular cylindrical base, a photosensitive semiconductor base plate, a cylindrical base, a first lens and a second lens, wherein the casing is provided with a loudspeaker cavity, a butt joint passage is formed at the upper part of the casing, the butt joint with external optical fiber can be realized, the luminous semiconductor base plate is in an annular plate shape, the annular cylindrical base is used for correspondingly installing the luminous semiconductor base plate, the photosensitive semiconductor base plate is in a round plate shape, the cylindrical base is used for correspondingly installing the photosensitive semiconductor base plate, the longitudinal section of the first lens comprises a square shape positioned in the middle and two trapezoids respectively positioned at the two sides, the two trapezoid parts of the first lens are correspondingly positioned above the luminous semiconductor base plate, the square part of the first lens is correspondingly positioned above the photosensitive semiconductor base plate, the second lens is a collimating lens, and a light emitting diode included by the luminous semiconductor base plate and a photosensitive device included by the photosensitive semiconductor base plate correspond to the same kind of spectrum. The encapsulation structure can promote the plastic optical fiber communication application.

Description

technical field [0001] The invention relates to an information collection system for common utilities, in particular to an electric energy information collection system using plastic optical fiber communication. Background technique [0002] The power information collection system usually adopts a master-slave communication network. After more than 20 years of development, the system currently has three communication methods: low-voltage power carrier communication, RS485 bus communication, and short-distance wireless communication. However, these three communication methods have relatively serious defects. The low-voltage power carrier communication has insufficient real-time stability, the RS485 bus communication has weak anti-electromagnetic interference and anti-lightning strike capabilities, and short-distance wireless communication is easily affected by weather changes and buildings. Obviously, none of these three technical means can meet the requirements of real-time...

AI Technical Summary

Problems solved by technology

Because of the difference between the sending spectrum and the photosensitive spectrum, the disadvantages of this package are obvious: the two nodes need to be used in strict pairing, and it is necessary to confirm whether the photoelectric conversion modules at both ends match when connecting optical fibers on site.

This increases the workload of on-site construction wiring and is easy to cause human-made construction wiring errors; the effective communication distance is determined by the spectrum with a large attenuation of the two spectra in the same optical fiber, which is not conducive to the maximum technical potential

Images