Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

De-burring method for high-frequency printed circuit board

A printed circuit board, deburring technology, applied in the direction of manufacturing tools, grinding machines, metal processing equipment, etc., can solve the problems of low efficiency and high production cost

Inactive Publication Date: 2015-02-18
MEIZHOU ZHIHAO ELECTRONICS TECH
View PDF5 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention mainly solves the technical problems of high production cost and low efficiency of the existing high-frequency printed circuit board deburring method

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • De-burring method for high-frequency printed circuit board
  • De-burring method for high-frequency printed circuit board
  • De-burring method for high-frequency printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0016] A method for deburring a high-frequency printed circuit board, including a ceramic-based printed circuit board, a computer numerical control system and a mechanical gong machine, see figure 1 , is a flow chart of the steps of the method for deburring a high-frequency printed circuit board provided by the present invention. The method comprises the steps of:

[0017] Step S1, providing a multilayer ceramic-based printed circuit board including slots;

[0018] Step S2, providing a first gong knife according to...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a de-burring method for a high-frequency printed circuit board. The method comprises the following steps of providing a multi-layer ceramic base printed circuit board with a slot; according to the size of the slot, providing a first milling knife, wherein a computer digital control system controls the first milling knife through a mechanical milling machine to crudely mill the slot; according to the size of the slot, providing a second milling knife, wherein the computer digital control system controls the second milling knife through the mechanical milling machine to finely mill the slot. Compared with the prior art, the de-burring method for the high-frequency printed circuit board provided by the invention has the advantages that the high-frequency board is molded in the mode that crude milling in the positive direction and fine milling in the negative direction are combined, i.e. the milling knife with the width smaller than the width of the slot is used for cutting the middle of the slot in the position where the slot is required to be molded to crudely mill, and then the milling knife with the width equal to the width of the slot is used for fine milling in the reversing direction, so that burrs generated when the knife is positively travelled are removed, and the aim of de-burring the surface of the high-frequency printed circuit board is fulfilled.

Description

technical field [0001] The invention relates to the field of manufacturing printed circuit boards, in particular to a method for deburring high-frequency printed circuit boards. Background technique [0002] As a special basic carrier in the electronic communication industry, high-frequency printed circuit board plays a very important role in the communication industry. Its main characteristics are high signal frequency, low transmission speed, and low signal loss. At present, among ceramic-based printed circuit boards, aluminum oxide substrate (AIO) printed circuit boards are the most widely used due to their high cost performance. Ceramic-based printed circuit boards, especially multi-layer ceramic-based printed circuit boards, are high-end products in printed circuit boards because of their high technical content, difficult production, and wide application range. Ceramic-based printed circuit boards are mainly aimed at high-density power supply products and high-frequenc...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): B24B9/02
CPCB24B9/02
Inventor 张学平刘喜科戴晖
Owner MEIZHOU ZHIHAO ELECTRONICS TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products