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MEMS (micro-electro-mechanical systems) omnidirectional vibration sensor

A vibration sensor and sensor technology, which is applied in the direction of seismic signal receivers, etc., can solve the problem that there is no suitable variable buried to effectively obtain blasting vibration signal vector information, and achieve the effects of reducing complexity and volume, increasing resonance frequency, and uniform density

Inactive Publication Date: 2015-03-04
GUANGXI ZHITONG ENERGY SAVING ENVIRONMENTAL PROTECTION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is how to overcome the existing defects such as no vibration sensor suitable for buried underground and effectively obtaining blasting vibration signal vector information

Method used

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  • MEMS (micro-electro-mechanical systems) omnidirectional vibration sensor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Such as figure 1 As shown, the present invention provides a MEMS omnidirectional vibration sensor, comprising a sensor housing 5, a printed circuit board 3, a MEMS level three-axis capacitive accelerometer 2, a MEMS level three-axis magnetoresistive sensor 1 and a three-dimensional acceleration sensor 4, The sensor housing 5 is spherical and composed of potting materials. The MEMS-level three-axis capacitive accelerometer 2 is installed at the center of gravity of the sensor housing 5 for three-dimensional omnidirectional vibration measurement. The MEMS A grade three-axis capacitive accelerometer 2, a MEMS grade three-axis magnetoresistive sensor 1 and a three-dimensional acceleration sensor 4 are installed on a printed circuit board 3; the printed circuit board 3 is directly cast on the sensor shell by using potting and molding processes in the plane of the center of gravity of body 5.

[0021] The diameter of the sensor housing 5 is 3 cm.

[0022] The printed circui...

Embodiment 2

[0026] Such as figure 1 As shown, the present invention provides a MEMS omnidirectional vibration sensor, comprising a sensor housing 5, a printed circuit board 3, a MEMS level three-axis capacitive accelerometer 2, a MEMS level three-axis magnetoresistive sensor 1 and a three-dimensional acceleration sensor 4, The sensor housing 5 is spherical and composed of potting materials. The MEMS-level three-axis capacitive accelerometer 2 is installed at the center of gravity of the sensor housing 5 for three-dimensional omnidirectional vibration measurement. The MEMS A grade three-axis capacitive accelerometer 2, a MEMS grade three-axis magnetoresistive sensor 1 and a three-dimensional acceleration sensor 4 are installed on a printed circuit board 3; the printed circuit board 3 is directly cast on the sensor shell by using potting and molding processes in the plane of the center of gravity of body 5.

[0027] The diameter of the sensor housing 5 is 4 cm.

[0028] The printed circui...

Embodiment 3

[0032] Such as figure 1 As shown, the present invention provides a MEMS omnidirectional vibration sensor, comprising a sensor housing 5, a printed circuit board 3, a MEMS level three-axis capacitive accelerometer 2, a MEMS level three-axis magnetoresistive sensor 1 and a three-dimensional acceleration sensor 4, The sensor housing 5 is spherical and composed of potting materials. The MEMS-level three-axis capacitive accelerometer 2 is installed at the center of gravity of the sensor housing 5 for three-dimensional omnidirectional vibration measurement. The MEMS A grade three-axis capacitive accelerometer 2, a MEMS grade three-axis magnetoresistive sensor 1 and a three-dimensional acceleration sensor 4 are installed on a printed circuit board 3; the printed circuit board 3 is directly cast on the sensor shell by using potting and molding processes in the plane of the center of gravity of body 5.

[0033] The diameter of the sensor housing 5 is 5 cm.

[0034] The printed circui...

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Abstract

The invention discloses an MEMS (micro-electro-mechanical systems) omnidirectional vibration sensor which comprises a spherical sensor shell, a printed circuit board, an MEMS triaxial capacitive accelerometer, an MEMS triaxial magnetoresistive sensor and a three-dimensional acceleration sensor, the sensor shell is made of encapsulating materials, the MEMS triaxial capacitive accelerometer is mounted at the gravity center of the sensor shell and used for three-dimensional omnidirectional vibration measurement, and the MEMS triaxial capacitive accelerometer, the MEMS triaxial magnetoresistive sensor and the three-dimensional acceleration sensor are mounted on the printed circuit board. By the aid of encapsulating and molding process, the printed circuit board is directly cast in a gravity plane of the sensor shell. The sensor shell and soil particles synchronously vibrate, density uniformity and isotropic homogeneity of the sensor shell are ensured by selecting the printed circuit board and the encapsulating materials, and omnidirectional receiving of blasting vibration signals is realized.

Description

technical field [0001] The invention relates to the field of sensors for underground shallow distributed seismic source positioning, in particular to a MEMS omnidirectional vibration sensor. Background technique [0002] Underground shallow distributed seismic source positioning technology is to bury a large number of sensor nodes at different depths underground in the near-field monitoring area of ​​underground seismic sources, and through a wireless network composed of self-organization and multi-hop methods, cooperative perception, monitoring, acquisition, processing and The vibration signal generated by the seismic source is transmitted, and the characteristics of the vibration information collected by each node are analyzed to realize the positioning of the seismic source. [0003] Compared with large-area, large-equivalent, and large-depth vibration monitoring such as earthquakes, deep coal mining, and oil exploration, the distributed shallow underground seismic source...

Claims

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Application Information

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IPC IPC(8): G01V1/18
Inventor 黄能蔡桂钧
Owner GUANGXI ZHITONG ENERGY SAVING ENVIRONMENTAL PROTECTION TECH
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