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PCM (phase-change material), phase change memory made of PCM and production method of phase change memory

A phase-change memory and phase-change material technology, applied in the field of microelectronics, can solve the problems of high power consumption, slow crystallization speed, and slow erasing and writing speed of phase-change memory devices, and achieve high-temperature data retention and reliability improvement. The effect of fast change speed and low write operation current

Active Publication Date: 2015-03-11
SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a phase change material, a phase change memory made of the phase change material and a preparation method, which are used to solve the problem of the low crystallization temperature of the phase change material in the prior art. , poor high temperature data retention, slow crystallization speed, high power consumption and slow erasing and writing speeds in phase change memory devices

Method used

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  • PCM (phase-change material), phase change memory made of PCM and production method of phase change memory

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Embodiment 1

[0044] The invention provides a preparation method of a phase change memory, the phase change memory contains Cr x Sb y Te 1 Phase change material, its preparation process is as follows:

[0045] Step 1: forming the lower electrode layer 11 .

[0046] Such as figure 2 As shown, using sputtering method, evaporation method, chemical vapor deposition (CVD), plasma enhanced chemical vapor deposition (PECVD), low pressure chemical vapor deposition (LPCVD), metal compound vapor deposition (MOCVD), molecular beam The lower electrode layer 11 is prepared by any one of epitaxy (MBE), atomic vapor deposition (AVD) or atomic layer deposition (ALD). In this embodiment, the lower electrode layer is prepared by chemical vapor deposition 11.

[0047] The material of the lower electrode layer 11 is one of the single metal materials W, Pt, Au, Ti, Al, Ag, Cu or Ni, or an alloy material composed of any two or more of the single metal materials , or the nitride or oxide of the single meta...

Embodiment 2

[0059] The present invention provides a method for preparing a phase-change memory. This embodiment adopts the same technical solution as Embodiment 1. The difference is that the method for preparing the phase-change material layer 12 is changed to the atomic vapor deposition method, and the remaining steps are the same as Embodiment 1 is completely the same, and can also achieve the same technical effect.

Embodiment 3

[0061] The present invention provides a method for preparing a phase-change memory. This embodiment adopts the same technical solution as that of Embodiment 1 and Embodiment 2, and the difference is that the Sb in Embodiment 1 and Embodiment 2 2.5 Te 1 Alloy target changed to Sb 2 Te 1 alloy target. The rest of the steps are exactly the same as those in Embodiment 1 and Embodiment 2.

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Abstract

The invention provides PCM. The PCM is a compound with component general formula of Cr<x>Sb<y>Te<1>. As atomic ratios of elements, x is larger than 0 and smaller than 1, and y is no smaller than 0 and no larger than 3.5. The invention further provides a phase change memory made of the PCM and a production method of the phase change memory. According to the arrangement, Cr-Sb-Te sulfur-based compound phase change material provided allows reversible transformation between high resistance state and low resistance state under action of external energy; as the Cr-Sb-Te sulfur-based compound phase change material serves as memory medium of the phase-change memory, a phase-change memory unit is high in phase change speed, low in write operation current and the like, and high-temperature data retention and reliability of a device are improved. Aims to memory principle and characteristics of the phase-change memory, a phase-change memory unit structure based on the novel phase change material Cr<x>Sb<y>Te<1> is further provided, allowing the phase-change memory comprising the Cr<x>Sb<y>Te<1> phase change material is high in speed, low in consumption, high in data retention and the like.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a phase change material, a phase change memory made of the phase change material and a preparation method. Background technique [0002] In the semiconductor market, memory occupies an important position. Phase change memory using phase change thin film material as storage medium is considered to be the most potential next-generation non-volatile memory. Phase-change memory technology is based on the Ovshinsky electronic effect memory proposed by S.R.Ovshinsky in the late 1960s and early 1970s. Its key materials include phase-change films as storage media, heating electrode materials, insulating materials and lead-out electrodes. materials etc. The basic principle of phase change memory is: apply electrical pulse signal to the device unit, make the phase change material produce reversible transition between the amorphous state and the crystalline state, use the materia...

Claims

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Application Information

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IPC IPC(8): H01L45/00
Inventor 王青刘波夏洋洋张中华宋三年宋志棠封松林
Owner SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI
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