Three dimension (3D) printing method for multilayer flexible circuit board
A flexible circuit board and 3D printing technology, which is applied in multilayer circuit manufacturing, printed circuit, printed circuit manufacturing, etc., can solve problems such as the production disadvantages of multilayer flexible circuit boards, and achieve low production costs, high precision, and simple processes. Effect
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[0015] In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the following specific embodiments are described in detail with reference to the accompanying drawings.
[0016] The present invention relates to a 3D printing method of a multilayer flexible circuit board, which is carried out as follows:
[0017] 1) Provide a substrate material, which is composed of polyimide powder, polyester powder and acrylic UV shadowless glue; the materials provided as the metal conductor are copper powder, cobalt-chromium alloy powder, gold powder and silver powder. ;
[0018] 2) Start printing from the bottom circuit board of the multilayer flexible circuit board, and print each layer obtained by cutting layer by layer in a specific direction according to the 3D CAD model. The printing direction of each layer is the x-axis direction first and then the y-axis direction , The printing starting point is the top left corner of the bottom...
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