Three dimension (3D) printing method for multilayer flexible circuit board
A flexible circuit board and 3D printing technology, which is applied in multilayer circuit manufacturing, printed circuit, printed circuit manufacturing, etc., can solve problems such as the production disadvantages of multilayer flexible circuit boards, and achieve low production costs, high precision, and simple processes. Effect
Active Publication Date: 2015-03-11
FUZHOU UNIVERSITY
10 Cites 27 Cited by
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The invention relates to a three dimension (3D) printing method for a multilayer flexible circuit board. The method comprises a first step of offering a baseplate material and materials of a metal conductor, wherein the baseplate material comprises polyimide, dacron powder and acrylic ultraviolet (UV) invisible glue, and the materials of the metal conductor comprise copper powder, cobalt-chromium alloy powder, gold powder and silver powder; a second step of printing the multilayer flexible circuit board from the lowermost layer, wherein each layer is printed through slitting layer by layer in a specific direction according to a 3D computer-aided design (CAD) model, each layer is printed firstly in x axis direction and then in y axis direction, printing starts from the vertex of top left corner of the lowermost layer, and the whole multilayer circuit board is printed firstly in x axis direction, then y and finally z. The 3D printing method can rapidly prepare the integral multilayer flexible circuit board, is simple, uses few materials and has high precision; furthermore, the 3D printing method can help lower manufacture cost of enterprises, and can realize change from volume production of the flexible circuit board to customized production.
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Technology Topic
Cobalt chromium alloyPrint-through +8
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Property | Measurement | Unit |
Thickness | 30.0 ~ 80.0 | µm |
tensile | MPa | |
Particle size | Pa | |
strength | 10 |
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