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Three dimension (3D) printing method for multilayer flexible circuit board

A flexible circuit board and 3D printing technology, which is applied in multilayer circuit manufacturing, printed circuit, printed circuit manufacturing, etc., can solve problems such as the production disadvantages of multilayer flexible circuit boards, and achieve low production costs, high precision, and simple processes. Effect

Active Publication Date: 2015-03-11
FUZHOU UNIVERSITY
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Problems solved by technology

[0004] The invention provides a 3D printing method for a multi-layer flexible circuit board, which helps to solve the problem of production drawbacks of the existing multi-layer flexible circuit board

Method used

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  • Three dimension (3D) printing method for multilayer flexible circuit board

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Embodiment Construction

[0015] In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

[0016] The invention relates to a 3D printing method of a multilayer flexible circuit board, which is carried out according to the following steps:

[0017] 1) Provide the substrate material, which is composed of polyimide powder, polyester powder and acrylic UV shadowless glue; the materials provided as the metal conductor part are copper powder, cobalt-chromium alloy powder, gold powder and silver powder. ;

[0018] 2) Printing starts from the bottom circuit board of the multi-layer flexible circuit board, and prints each layer obtained by cutting layer by layer according to the 3D CAD model in a specific direction. The printing direction of each layer is first the x-axis direction and then the y-axis direction , the printing starting point is the vertex i...

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Abstract

The invention relates to a three dimension (3D) printing method for a multilayer flexible circuit board. The method comprises a first step of offering a baseplate material and materials of a metal conductor, wherein the baseplate material comprises polyimide, dacron powder and acrylic ultraviolet (UV) invisible glue, and the materials of the metal conductor comprise copper powder, cobalt-chromium alloy powder, gold powder and silver powder; a second step of printing the multilayer flexible circuit board from the lowermost layer, wherein each layer is printed through slitting layer by layer in a specific direction according to a 3D computer-aided design (CAD) model, each layer is printed firstly in x axis direction and then in y axis direction, printing starts from the vertex of top left corner of the lowermost layer, and the whole multilayer circuit board is printed firstly in x axis direction, then y and finally z. The 3D printing method can rapidly prepare the integral multilayer flexible circuit board, is simple, uses few materials and has high precision; furthermore, the 3D printing method can help lower manufacture cost of enterprises, and can realize change from volume production of the flexible circuit board to customized production.

Description

technical field [0001] The invention relates to a 3D printing method of a multilayer flexible circuit board, which is applied to the 3D flexible circuit board. Background technique [0002] 3D printer, also known as three-dimensional printer, is a technology based on the principle of raw material injection molding, which belongs to the category of rapid prototyping technology. It comprehensively applies CAD / CAM technology, laser technology, photochemistry and material science and many other technologies and knowledge. Before printing, it is necessary to use computer modeling software to model, and then "partition" the built 3D model, which is called a layer-by-layer section, and then guide the 3D printer to print layer by layer. Compared with traditional manufacturing technology, 3D printing technology has the advantages of saving cost, rapid prototyping, improving production efficiency, and shifting from traditional mass production to mass customization. It is predicted tha...

Claims

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Application Information

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IPC IPC(8): H05K3/46B29C67/00
CPCH05K3/46H05K2203/108
Inventor 叶芸郭太良林志贤姚剑敏黄炳乐蓝琪
Owner FUZHOU UNIVERSITY
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