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Multiple-tube-core electronic direct-writing ballpoint pen

A ballpoint pen and multi-die technology, applied in circuits, electrical components, printed circuits, etc., can solve the problems of high material and energy consumption, complex circuit or electronic device manufacturing procedures, and high environmental pollution, and achieve energy consumption and material invalid loss. Low, reduced complexity and cost, increased productivity

Inactive Publication Date: 2015-03-18
TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to provide a multi-core electronic direct-writing ballpoint pen that can directly write or print circuits and electronic devices, so as to meet the needs of rapid electronic and personalized electronic design and manufacturing, and partially solve the problem of circuit or electronic device manufacturing procedures. Complexity, large material and energy consumption, relatively high environmental pollution, etc.

Method used

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  • Multiple-tube-core electronic direct-writing ballpoint pen
  • Multiple-tube-core electronic direct-writing ballpoint pen

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Embodiment Construction

[0023] The specific implementation manners of the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0024] Such as figure 1 and figure 2 As shown, the multi-core electronic direct-writing ballpoint pen according to the embodiment of the present invention includes a pen holder structure and a refill 4 loaded with different inks.

[0025] Wherein, the pen holder structure includes: a pen case 1 , a pen core button 2 and a pen core spring 3 .

[0026] The pen case 1 is used for packaging and carrying the refill button 2, the refill spring 3 and the refill 4. The pen case 1 can be used for carrying components and 1-50 refills filled with ink. figure 2 The pen shell 1 shown in the figure carries components and four pen refills 4, which are respectively loaded with liquid...

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Abstract

The invention discloses a multiple-tube-core electronic direct-writing ballpoint pen which includes a penholder structure used for loading a multi-tube pen core which is provided with a liquid metal conductive ink, an insulating ink and a semiconductor ink; and pen cores used for loading the liquid metal conductive ink, the insulating ink and the semiconductor ink and enabling the inks to be directly written on a substrate, wherein the liquid metal conductive ink is used for printing or writing a conductor structure, the semiconductor ink is used for printing or writing a semiconductor structure and the insulating ink is used for packaging the conductor structure or the semiconductor structure. In the multiple-tube-core electronic direct-writing ballpoint pen used for a directly writing circuit and an electronic device, because the printable liquid metal conductive ink and the supporting semiconductor ink are introduced, the circuit and the electronic device can be directly manufactured in a writing-like method.

Description

technical field [0001] The invention relates to the field of printed electronics manufacturing technology, in particular to a multi-core electronic direct-writing ballpoint pen capable of directly writing and packaging liquid metal circuits, semiconductor structures and devices. Background technique [0002] Printed electronics technology is an electronic manufacturing technology based on the printing principle (additive technology). However, in the past few decades, silicon-based microelectronics manufacturing technology has occupied an absolute dominant position in the field of electronic manufacturing. Integrated circuit technology processing and manufacturing processes mainly include oxidation, photolithography, diffusion, epitaxy, sputtering, vacuum deposition, etc. In recent years, the disadvantages of this circuit manufacturing technology have gradually been recognized, including complex manufacturing process, high energy consumption, high pollution, high cost, and hi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/00H05K3/00B41J2/005
CPCH01L21/6715B41J2/005H05K3/0002
Inventor 郑义刘静
Owner TECHNICAL INST OF PHYSICS & CHEMISTRY - CHINESE ACAD OF SCI
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