Circuit board and manufacturing method thereof

A manufacturing method and circuit board technology, applied in the directions of printed circuits, printed circuits, circuit devices, etc., can solve the problems of increased circuit board time, high circuit board production costs, easy to be scrapped, etc., to prevent electromagnetic interference and reduce manufacturing costs. , the effect of improving yield

Inactive Publication Date: 2015-03-18
AVARY HLDG (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the obtained product, in order to make the metal film tightly bonded to the flexible circuit board, it is necessary to first attach the conductive silver foil to the circuit board and then perform thermal compression bonding, which increases the time for circuit board production
Moreover, the conductive silver foil is relatively fragile, and it is easy to be scrapped during the bonding process, thereby increasing the production cost of the circuit board
Further, the price of conductive silver foil is more expensive, resulting in higher production costs of circuit boards

Method used

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  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof
  • Circuit board and manufacturing method thereof

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Embodiment Construction

[0016] The circuit board provided by the technical solution and its manufacturing method will be further described in detail below in conjunction with the accompanying drawings and embodiments.

[0017] The manufacturing method of the circuit board provided by the embodiment of the technical solution includes the following steps:

[0018] For the first step, please also refer to figure 1 and figure 2 , providing a circuit substrate 110 .

[0019] In this embodiment, the circuit substrate 110 is a circuit board with conductive lines formed thereon. The circuit substrate 110 includes a first insulating layer 111 , a grounding conductive layer 112 , a second insulating layer 113 , a conductive circuit layer 114 and a third insulating layer 115 arranged in sequence.

[0020] The circuit substrate 110 has an electromagnetic shielding forming area 101 and a common area 102 except the electromagnetic shielding forming area 101 , and the electromagnetic shielding forming area 101 ...

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Abstract

The invention discloses a circuit board. The circuit board comprises a circuit substrate, a conductive polymeric membrane layer and a copper plating shielding layer, wherein the circuit substrate comprises a conductive circuit layer and a third insulating layer; the conductive circuit layer and the conduction circuit layer are formed on the two opposite sides of the third insulating layer; the conductive circuit layer comprises a signal circuit and a grounding circuit; the copper plating shielding layer is formed on the surface of the copper plating shielding layer in an electroplating way; a second conductive hole is formed in the third insulating layer; the grounding circuit is electrically connected to the copper plating shielding layer through the second conductive hole. The invention also provides a manufacturing method of the circuit board.

Description

technical field [0001] The invention relates to circuit board manufacturing technology, in particular to a circuit board and a manufacturing method thereof. Background technique [0002] Due to the thinner and thinner requirements of the flexible circuit board, when the internal circuit is used as the signal line for external signal transmission, it is usually necessary to use conductive silver foil (EMI shielding film) to cover the outer layer of the flexible circuit board to prevent interference caused by external electromagnetic interference. Signal loss. [0003] Conductive silver foil usually has a four-layer structure, namely protective film, metal film, conductive adhesive and release film. Before bonding, the release film needs to be removed to combine the conductive adhesive with the flexible circuit board. In the obtained product, in order to enable the metal film to be closely combined with the flexible circuit board, it is necessary to first attach the conducti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H05K3/40
CPCH05K1/0219H05K2201/0715
Inventor 何明展胡先钦沈芾云
Owner AVARY HLDG (SHENZHEN) CO LTD
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