Method for forming metalized pattern using jet printing and molded interconnected assembly thereof

A technology of metallization patterns and jet printing, which is applied in chemical instruments and methods, metal layered products, replication/marking methods, etc., can solve the problems of lack of precious metal catalyst inks, etc., and achieve uniform noble metal catalyst layers, large surface area, and increased activity Effect

Active Publication Date: 2015-03-25
张益诚
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  • Abstract
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Problems solved by technology

However, although these disclosed technologies have disclosed the method of making metallized patterns by jet printing, they still lack the composition of the noble metal catalyst ink to avoid the noble metal catalyst ink from clogging and stabilize the pH value. The catalyst

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  • Method for forming metalized pattern using jet printing and molded interconnected assembly thereof
  • Method for forming metalized pattern using jet printing and molded interconnected assembly thereof
  • Method for forming metalized pattern using jet printing and molded interconnected assembly thereof

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Embodiment Construction

[0063] The following are examples, but the contents of the present invention are not limited to the scope of these examples.

[0064] The aforementioned and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description with reference to the drawings and embodiments.

[0065] See figure 2 and 3 , figure 2 It is a step diagram of the method for forming a metallized pattern by jet printing in the present invention, image 3It is a schematic diagram of the method of forming a metallized pattern by spray printing in the present invention. The method of the present invention is to cover the plastic, glass or ceramic plastic mold component 2 substrate 21 with a patterned metal pattern with good adhesion and stability. layer 4, or further form a conductive layer 5 on the metal pattern layer 4 to make a metallized pattern molded interconnection component 1; wherein, when the material of the base material sel...

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Abstract

The invention relates to a method for forming a metalized pattern using jet printing and a molded interconnected assembly thereof. The method for forming a metalized pattern using jet printing comprises: modifying the surface of a nonmetallic base material by using a mechanical method or chemical method; coating the surface of the improved base material with the metalized pattern in a jet printing manner by using precious metal accelerant ink of temperature-sensitive polymer with catalyst metallic particles; forming the metalized pattern on a part where the precious metal accelerant ink is jet printed by using an electroless electroplating method, wherein the viscosity and the surface tension of the precious metal accelerant ink are adjusted by a viscosity modifier; and improving the adhesion of the metalized pattern and the base material by using the temperature-sensitive polymer. The invention further discloses a 2D or 3D molded interconnected assembly by forming a metalized pattern on a molded assembly by using the method for forming a metalized pattern using jet printing, wherein the molded interconnected assembly is applied to RFID, mobile communication device housing, automobile electronic assemblies, and 3D LED assemblies.

Description

technical field [0001] The present invention relates to a method for forming a metallization pattern by spray printing and its molded interconnection assembly, especially using a temperature-sensitive polymer noble metal catalyst ink to form a metallization pattern by spray printing and electroless plating to manufacture Formed in a molded interconnect device. Background technique [0002] Short, thin and light digital communication electronic components have become the focus of today's technological development, so the production technology of many metallized circuits has become the main axis of the development of digital communication electronic products; now smart phones have changed the mainstream design mode of traditional mobile phone parts, in the "mobility" Under the concept of mobile demand and further space-saving requirements, the mobile phone transceiver antenna parts based on printed circuit boards in the past are no longer suitable for use, and the 3D metallize...

Claims

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Application Information

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IPC IPC(8): B41M5/00B41M1/22B32B15/08B32B33/00
Inventor 葛明德张章平刘益铭粘晏瑜王柏强
Owner 张益诚
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