Method for forming metalized pattern using jet printing and molded interconnected assembly thereof

Abstract

The invention relates to a method for forming a metalized pattern using jet printing and a molded interconnected assembly thereof. The method for forming a metalized pattern using jet printing comprises: modifying the surface of a nonmetallic base material by using a mechanical method or chemical method; coating the surface of the improved base material with the metalized pattern in a jet printing manner by using precious metal accelerant ink of temperature-sensitive polymer with catalyst metallic particles; forming the metalized pattern on a part where the precious metal accelerant ink is jet printed by using an electroless electroplating method, wherein the viscosity and the surface tension of the precious metal accelerant ink are adjusted by a viscosity modifier; and improving the adhesion of the metalized pattern and the base material by using the temperature-sensitive polymer. The invention further discloses a 2D or 3D molded interconnected assembly by forming a metalized pattern on a molded assembly by using the method for forming a metalized pattern using jet printing, wherein the molded interconnected assembly is applied to RFID, mobile communication device housing, automobile electronic assemblies, and 3D LED assemblies.

Description

technical field [0001] The present invention relates to a method for forming a metallization pattern by spray printing and its molded interconnection assembly, especially using a temperature-sensitive polymer noble metal catalyst ink to form a metallization pattern by spray printing and electroless plating to manufacture Formed in a molded interconnect device. Background technique [0002] Short, thin and light digital communication electronic components have become the focus of today's technological development, so the production technology of many metallized circuits has become the main axis of the development of digital communication electronic products; now smart phones have changed the mainstream design mode of traditional mobile phone parts, in the "mobility" Under the concept of mobile demand and further space-saving requirements, the mobile phone transceiver antenna parts based on printed circuit boards in the past are no longer suitable for use, and the 3D metallize...

AI Technical Summary

Problems solved by technology

However, although these disclosed technologies have disclosed the method of making metallized patterns by jet printing, they still lack the composition of the noble metal catalyst ink to avoid the noble metal catalyst ink from clogging and stabilize the pH value. The catalyst ink should be able to match the electroless plating method, so that the composition or temperature of the electroless plating solution will not damage the precious metal catalyst ink, so that the adhesion of the metallized pattern meets the practical needs and other technologies

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