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Sing-component epoxy resin adhesive capable of quickly curing at 80 DEG C

An epoxy resin, rapid curing technology, applied in the direction of epoxy resin glue, adhesive, polymer adhesive additives, etc., can solve the problem of long curing time, achieve high strength and easy to use

Active Publication Date: 2015-03-25
三友(天津)高分子技术有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the existing one-component epoxy resin adhesives have a relatively high curing temperature, above 150°C, and a relatively long curing time, above 0.5 hours.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0026] Example 1 takes by weight percentage,

[0027] 6458 bisphenol F epoxy resin 45%

[0028] PCM-12 Vinyl Resin 7.5%

[0029] EH4342 latent curing agent 18%

[0030] PN40 9%

[0031] 748 Thinner 6%

[0032] Dioctyl Adipate 4%

[0033] L07 2.5%

[0034] M5 1.5%

[0035] Alumina powder 6%

[0036] Carbon black 0.5%

[0037] Preparation:

[0038] Weigh 6458 bisphenol F epoxy resin, 748 diluent, dioctyl adipate, L07 and PCM-12 vinyl acetate resin according to the weight ratio and mix them, then disperse and stir at high speed for 10~15 minutes, then add the remaining components and stir After uniformity, use a three-roller mill to roll 3 to 4 times, and then vacuum defoam under stirring for 20 to 30 minutes to obtain the product.

example 2

[0039] Example 2 takes by weight percentage,

[0040] E54 bisphenol A epoxy resin 42%

[0041] MP12 polyacrylic resin 5%

[0042] EH4070 latent curing agent 16%

[0043] PN40 6%

[0044] FXR1020 3%

[0045] 746 Thinner 8%

[0046] Dibutyl sebacate 6%

[0047] Butyl borate 3%

[0048] M5 1%

[0049] Barium Sulfate 8%

[0050] Titanium dioxide 2%.

[0051] Preparation:

[0052] Weigh E54 bisphenol A epoxy resin, 746 diluent, dibutyl sebacate, butyl borate and MP12 polyacrylic acid resin according to the weight ratio and mix them, then disperse and stir at high speed for 10~15 minutes, then add the remaining components and stir After uniformity, use a three-roller mill to roll 3 to 4 times, and then vacuum defoam under stirring for 20 to 30 minutes to obtain the product.

example 3

[0053] Example 3 is taken by weight percentage,

[0054] 6458 bisphenol F epoxy resin 35%

[0055] E54 bisphenol A epoxy resin 15%

[0056] PMC-12 Vinyl Resin 6%

[0057] Melamine 8%

[0058] PN40 12%

[0059] 746 Thinner 4%

[0060] Dioctyl Adipate 2%

[0061] Butyl borate 3%

[0062] HL200 1%

[0063] Barium Sulfate 12%

[0064] Iron Oxide Red 2%.

[0065] Preparation:

[0066] Weigh 6458 bisphenol F epoxy resin, E54 bisphenol A epoxy resin, 746 diluent, dioctyl adipate, butyl borate and PMC-12 vinyl chloride resin according to the weight ratio and mix them, then disperse and stir at high speed After 10-15 minutes, add the remaining ingredients and stir evenly, then roll 3-4 times with a three-roller mill, and then vacuum defoam for 20-30 minutes under stirring to obtain the product.

[0067]The main technical indicators of the one-component 80°C fast-curing epoxy resin adhesive prepared by the above method are as follows:

[0068] Rotational viscosity (25°C, mpa...

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Abstract

The invention relates to a sing-component epoxy resin adhesive capable of quickly curing at 80 DEG C. The sing-component epoxy resin adhesive comprises low-viscosity epoxy resin, a diluent, reinforced resin, a curing agent, an accelerating agent, a stabilizing agent, a thixotropic agent, a filler and a paint. A preparation method for the epoxy resin adhesive comprises the following steps: weighing low-viscosity epoxy resin, the diluent, the stabilizing agent and reinforced resin according to a weight ratio, wherein granulous reinforced resin needs to be pulverized to more than 100 meshes through a pulverizer, and is subjected to high-speed dispersion stirring for 10 to 15 minutes, and the other components are added; uniformly stirring, and rolling for 3-4 times through a three-roll milling machine; finally, defoaming under vacuum for 20 to 30 minutes while stirring to obtain the product of the sing-component epoxy resin adhesive. The sing-component epoxy resin adhesive has the benefits that preparation during use is eliminated as the epoxy resin adhesive is sing-component, and no volatile solvent is in a liquid adhesive; immediate lapping can be realized after adhesive spreading; the use is convenient; quick curing at 80 DEG C can be realized within 5 minutes, and the adhesive force and strength are high; the liquid adhesive can be stored for 3 months below 25 DEG C; the shearing strength after curing is larger than 12 Mpa; the epoxy resin adhesive is suitable for being used in industrial automatic production lines of machines, automobiles, electric products and the like.

Description

technical field [0001] The invention relates to a single-component 80°C fast-curing epoxy resin adhesive, which is suitable for fast bonding and sealing in automatic production lines. technical background [0002] Epoxy resin adhesive is one of the most widely used adhesive varieties due to its lack of volatile solvents, strong cohesive force, and good comprehensive performance. Commonly used epoxy resin adhesives are two-component or multi-component, which need to be prepared before use, which not only brings trouble to the construction, but also makes it difficult to mix fully due to the high viscosity of the adhesive components, and the performance of the cured product will be greatly reduced. One-component epoxy resin adhesives have developed rapidly in the past ten years and are widely used in machinery, automobiles, electronics and other industries. [0003] Most of the currently available one-component epoxy resin adhesives have a relatively high curing temperature, ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/06C09J11/04C09J11/08
Inventor 李士学胡建华高之香王永明李建武吴子刚张卫军
Owner 三友(天津)高分子技术有限公司
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