Chain type staggered micro-channel structure

Abstract

The invention discloses a chain type staggered micro-channel structure. The chain type staggered micro-channel structure comprises a substrate and micro fluid passageways arranged on the substrate. The chain type staggered micro-channel structure is characterized in that each micro fluid passageway comprises two branch micro fluid passageway bodies which intersect and are separated in a periodic mode, intersections are formed in the positions where the branch micro fluid passageway bodies intersect, and furcation openings are formed in the positions where the branch micro fluid passageway bodies are separated. According to the micro fluid passageways, the bent micro passageways are arc type channels periodically changing and are formed by smoothly connecting different gradients of arcs, and every two adjacent channels are symmetrical, intersect every other distance and are arranged according to arcs after intersecting. A cooling working medium smoothly flows in the channels, and the friction resistance coefficient is small. The two branch micro fluid passageway bodies of each micro fluid passageway are staggered, the redevelopment of the hot boundary layer on the front edge of each channel is caused, the thickness of the boundary layers is reduced, the fluid can be in the developing state all the time through the regenerated entrance effect, and the heat dissipation performance of heat dissipation devices is improved.

Description

technical field [0001] The invention belongs to the field of microelectronic high-power chip package heat dissipation, and in particular relates to a chain-type interlaced micro-channel structure. Background technique [0002] With the increasing number of semiconductors in integrated circuits and the miniaturization of packaging volume, the heat generation per unit volume of the chip is increasing significantly. If the heat cannot be effectively dissipated in a short time, it will have a negative impact on the life and performance of semiconductor devices. big impact. [0003] Traditional heat transfer methods include: air-cooled heat dissipation, water-cooled heat dissipation, heat pipe heat dissipation, thermoelectric cooling, micro-jet cooling and micro-channel cooling. Air-cooled heat dissipation has low cost and obvious heat dissipation effect, but due to the use of mechanical components, large volume and high noise, it cannot meet the heat dissipation requirements of...

AI Technical Summary

Problems solved by technology

[0007] 1) When the cooling working fluid flows through the heated long flat channel, the working fluid absorbs the heat transferred from the heat source to the side wall of the channel, so that the temperature of the working fluid increases continuously with the flow direction, and the temperature uniformity of the heating surface is not good. good

[0008] 2) When the fluid flows through the flat channel, with the formation and development of the thermal boundary layer, the convective heat transfer coefficient decreases with the flow direction, and the heat transfer efficiency is not high

[0011] 1) The flow channel of the microchannel is relatively long, which will consume more pump power and lower heat transfer efficiency

[0012] 2) When the fluid flows through the curved flow channel, the fluid mixing in the adjacent flow channel is insufficient, and the heat dissipation performance is low

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