High-radiating LED circuit board

A LED circuit board, high heat dissipation technology, applied in the direction of printed circuits, printed circuits, printed circuit components, etc., can solve the problems of the insulation layer losing the insulation effect, the insulation effect of the insulation layer cannot be guaranteed, and the heat cannot be transferred laterally.

Active Publication Date: 2015-03-25
SHENZHEN BOMIN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The insulation layer with a low heat transfer coefficient has serious barriers to the heat dissipation of LEDs. For LED products with small area and low power, the existing technology is to reduce the thickness of the insulation layer to enhance the heat transfer efficiency between the circuit layer and the heat dissipation base layer.
However, for high-power, large-area LED lighting and LED displays, reducing the thickness of the insulating layer cannot meet the heat transfer and heat dissipation requirements between the circuit layer and the heat dissipation base layer, especially the lateral conduction and transfer of more local heat.
In the end, it will lead to light decay and chromatic aberration of LED due to excessive temperature, which will affect the service life of LED products.
In addition, the insulating effect of the insulating layer that is too thin cannot be guaranteed, especially after aging in a high temperature environment, the insulating layer is easily broken and loses the insulating effect, and eventually the product is scrapped

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] This embodiment provides a high heat dissipation LED circuit board, such as figure 1 and figure 2 , from bottom to top, a 0.8mm thick heat dissipation base layer 1, a 0.65mm thick insulating and heat conducting layer 2 and a circuit layer 3 are sequentially provided. The heat dissipation base layer is a metal plate, and a plurality of tapered bumps 4 are provided on its upper surface; Two intersecting heat transfer strips 41 are arranged on the top of the tapered bump.

[0018] A concave curved surface 5 is provided on the lower surface of the heat dissipation base layer corresponding to the tapered bump; three cooling fins 6 are vertically provided on the concave curved surface; image 3 The surface of the heat dissipation fins is provided with a heat dissipation groove 61 perpendicular to the heat dissipation base layer; the cross section of the heat dissipation groove is triangular.

[0019] Two protruding annular rings 42 are provided on the surface of the tapere...

Embodiment 2

[0022] This embodiment provides a high heat dissipation LED circuit board, the structure of which is consistent with that of Embodiment 1. Particularly preferably, the heat dissipation base layer described in this embodiment is made of 96 parts by weight of aluminum, 3.2 parts of copper and 0.01 part of titanium dioxide, 0.005 parts of magnesium sulfate and 0.002 parts of nano-silver particles; the insulating and heat-conducting layer raw materials include 70 parts of polypropylene, 1 part of silicon dioxide particles, 4 parts of polycarbonate, 0.02 parts of flame retardant, 0.15 parts of lactic acid by weight Calcium and 1 part elemental sulfur.

Embodiment 3

[0024] This embodiment provides a high heat dissipation LED circuit board, the structure of which is consistent with that of Embodiment 1. Particularly preferably, the heat dissipation base layer described in this embodiment is made of 96 parts by weight of aluminum, 3.2 parts of copper and 0.01 part of titanium dioxide, 0.005 parts of magnesium sulfate and 0.002 parts of nano-silver particles; the insulating and heat-conducting layer raw materials include 60 parts of polypropylene, 5 parts of silicon dioxide particles, 3 parts of polycarbonate, 0.05 parts of flame retardants, and 0.01 parts of lactic acid by weight Calcium and 3 parts of elemental sulfur.

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Abstract

The invention discloses a high-radiating LED circuit board which is provided with a radiating base layer, an insulation heat conduction layer and a circuit layer from bottom to top in sequence. The radiating base layer is a metal plate, and a plurality of taper lugs are arranged on the upper surface of the metal plate, and two crossed heat conduction bars are arranged on the top of each taper lug. The contact area of the radiating base layer and the insulation heat conduction layer is increased through the taper lugs stretching into the insulation heat conduction layer, and thus the heat conduction efficiency between the radiating base layer and the insulation heat conduction layer is improved. In addition, the area of the tops of the taper lugs is small, and thus the insulation heat conduction layer can be prevented from being broken through by high tension electricity.

Description

technical field [0001] The invention relates to an LED circuit board, in particular to a high heat dissipation LED circuit board. Background technique [0002] LEDs (Light Emitting Diodes) are usually mounted on a circuit board and are controlled by the circuit board to emit light. LEDs will generate a lot of heat when they work, and the temperature of the LEDs needs to be controlled to ensure the stability of their working conditions. Existing circuit boards for mounting LEDs generally include a circuit layer and an aluminum heat dissipation base layer, and an insulating layer made of resin disposed between the circuit layer and the aluminum heat dissipation base layer. The insulation layer with a low heat transfer coefficient has serious barriers to the heat dissipation of LEDs. For LED products with small area and low power, the existing technology is to reduce the thickness of the insulation layer to enhance the heat transfer efficiency between the circuit layer and the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02
CPCH05K1/021H05K2201/066
Inventor 黄建国徐缓王强易胜
Owner SHENZHEN BOMIN ELECTRONICS
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