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Heat-conducting insulated epoxy resin composition and preparation method and use thereof

A technology of epoxy resin and epoxy resin, applied in the field of materials, can solve the problems of reducing the dielectric properties of epoxy resin, and achieve the effect of large particle size and improved thermal conductivity

Inactive Publication Date: 2015-04-01
INST OF PROCESS ENG CHINESE ACAD OF SCI +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Current reports such as CN 102532606, CN 103172913, and CN 2011102516766 introduce high thermal conductivity fillers such as micron-scale boron nitride (BN), aluminum nitride (AlN) to increase thermal conductivity, but the thermal conductivity of the prepared epoxy resin composite material Conductivity is usually less than 1W / m·K
US 7976941, US8404768 reported that the use of large-scale aggregated boron nitride powder can obtain improved thermal conductivity, but this method will seriously reduce the dielectric properties of epoxy resin
None of the above-mentioned existing technologies has reported further improving the thermal conductivity of epoxy insulating materials while ensuring the dielectric properties of the system.

Method used

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  • Heat-conducting insulated epoxy resin composition and preparation method and use thereof
  • Heat-conducting insulated epoxy resin composition and preparation method and use thereof
  • Heat-conducting insulated epoxy resin composition and preparation method and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-5

[0070] According to Table 1, the component C boron nitride agglomerates of the formula amount, the component D (a) micron plate-shaped boron nitride, and the component D (b) nano-spherical boron nitride are mixed uniformly by a mixer to obtain a filler mixture . Epoxy resin, curing agent, filler mixture, and solvent methyl ethyl ketone are uniformly dispersed and mixed by ultrasonic dispersion, and then further mixed by a high-speed mixer such as the high-speed mixer DISPERMAT of VMA-Getzmann Company, and the solvent is removed under high-temperature vacuum to form an uncured ring. oxygen composition. The uncured epoxy composition was poured into a preheated mold, and cured under a pressure of 50 MPa. The curing conditions were 115°C for 15 hours, and then 140°C for 12 hours.

[0071] The boron nitride aggregates, micron flake boron nitride, and nano-spherical boron nitride used in Examples 1-5 of the present invention are all surface treated, and the surface treatment agent ...

Embodiment 6-10

[0089] According to Table 5, the component C and the component D are mixed uniformly by a mixer to prepare a filler mixture. Epoxy resin, curing agent, filler mixture, and solvent methyl ethyl ketone are uniformly dispersed and mixed by ultrasonic dispersion, and then further mixed by a high-speed mixer such as the high-speed disperser DISPERMAT of VMA-Getzmann Company, and the solvent is removed under high temperature and vacuum to form an uncured ring. oxygen composition. The uncured epoxy composition was poured into a preheated mold, and cured under a pressure of 30MP. The curing condition was 105°C for 20h, and then 130°C for 16h.

[0090] The boron nitride aggregates, micron flaky boron nitride, micron ellipsoidal aluminum nitride, nano-spherical alumina, and nano-spherical silicon dioxide used in Examples 6-10 of the present invention are all surface treated, and the surface treatment agent is γ ~Glycidoxypropyltrimethoxysilane.

[0091] The formula and properties of t...

Embodiment 11-15

[0097] According to Table 1, the component C boron nitride agglomerates of the formula amount, the component D (a) micron plate-shaped boron nitride, and the component D (b) nano-spherical boron nitride are mixed uniformly by a mixer to obtain a filler mixture . Epoxy resin, curing agent, filler mixture, and solvent methyl ethyl ketone are uniformly dispersed and mixed by ultrasonic dispersion, and then further mixed by a high-speed mixer such as the high-speed mixer DISPERMAT of VMA-Getzmann Company, and the solvent is removed under high-temperature vacuum to form an uncured ring. oxygen composition. The uncured epoxy composition was poured into a preheated mold, and cured under a pressure of 70MP. The curing condition was 125°C for 8 hours, and then 150°C for 7 hours.

[0098] The formulations and properties of the epoxy resin compositions of Examples 11-15 of the present invention are listed in Table 7 and Table 8, respectively.

[0099] The epoxy resin composition formul...

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Abstract

The invention discloses an insulated epoxy resin composition with high thermal conductivity and a preparation method of the insulated epoxy resin composition. The composition comprises the following components: (A) one or more than two epoxy resins; (B) one or more than two anhydride curing agents; (C) a boron nitride aggregate; and (D) a micro-nano inorganic particle composition, wherein the mass percent of the component (C) in the epoxy resin composition is 50%-70%; and the mass percent of the component (D) in the epoxy resin composition is 15%-35%. The composition disclosed by the invention has the electric properties such as high thermal conductivity and excellent breakdown strength.

Description

technical field [0001] The invention belongs to the field of materials. Specifically, the invention relates to a thermally conductive and insulating epoxy resin composition, a preparation method and an application thereof. Background technique [0002] With the high power and integration of electrical and electronic equipment, the current density increases, and the heat dissipation and insulation requirements increase accordingly. Therefore, thermal interface materials used in high-voltage electrical appliances such as switchgear, transformers, rotating electrical machines, GIS and high-density integrated insulating electronic devices such as packaging systems require not only excellent dielectric properties, mechanical properties, but also high thermal conductivity. Epoxy resin can be widely used in the above electrical insulating materials, but its thermal conductivity is only 0.2W / m·K. The main method to improve the thermal conductivity of epoxy resin is to introduce hig...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/06C08K9/08C08K7/00C08K3/38C08K3/28C08K3/22C08K3/36
CPCC08K3/22C08K3/28C08K3/36C08K3/38C08K7/00C08K9/06C08K9/08C08L63/00
Inventor 王好盛张冬海薛杨陈赟邬瑞文张婧坤陈运法高锋陈卓张晖张忠尹立张翀田浩袁端鹏郝留成
Owner INST OF PROCESS ENG CHINESE ACAD OF SCI
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