Production method of high heat conduction insulating layer, and metal base copper-clad plate

Abstract

The invention provides a production method of a high heat conduction insulating layer. The method comprises the following steps: forming a high heat conduction composite fiber; grinding the high heat conduction composite fiber to form fiber powder; dissolving the fiber powder and an inorganic filler in a solvent containing epoxy resin and a curing agent to form a resin adhesive solution; and curing the resin adhesive solution to form the high heat conduction insulating layer. The invention also provides a metal base copper-clad plate. A technical scheme adopted in the invention improves the transverse heat radiation ability of the insulating layer, improves the heat radiation effect of the insulating layer, and reduces the filling content of inorganic substances in the insulating layer, so the high heat conduction insulating layer obtained in the invention has the advantages of excellent heat conductivity, good toughness and strong adhesion, thereby the reliability of the metal base copper-clad plate of the high heat conduction insulating layer material is improved.

Description

technical field [0001] The invention relates to the technical field of insulating layer manufacturing, and more specifically, relates to a method for manufacturing a high thermal conductivity insulating layer and a metal-based copper-clad laminate. Background technique [0002] With the development of electronic technology, the design of electronic components is becoming more and more miniaturized, and the circuit is becoming more and more refined. Therefore, it is necessary to meet the requirements of good circuit design flexibility and heat dissipation characteristics. Metal-based copper-clad laminates carrying electronic components have been widely used in LEDs, intelligent power modules, and power supplies due to their excellent heat dissipation, insulation performance, flexible circuit design, and excellent processing characteristics. [0003] In some fields such as LED lighting, TV, intelligent power devices, inverters, electric motors and power supplies, metal substra...

AI Technical Summary

Problems solved by technology

[0005] On the one hand, the heat dissipation method of heat-conducting inorganic powder achieves heat dissipation by filling a large amount of heat-conducting inorganic powder, which reduces the toughness, and the insulating layer generally shows the shortcomings of greater brittleness and poor adhesion, and it is easy to produce cracks or cracks during stamping and other processing processes. The insulation layer is peeled off from the surface of the board, which poses a great risk to product reliability;

[0006] On the other hand, high-power devices require good lateral heat dissipation, so that the heat can be quickly distributed inside the heat-dissipating substrate, filled with inorganic powder, and the horizontal and vertical heat dissipation effects are consistent, which cannot meet the needs of high-power devices for rapid lateral heat dissipation

Images