Metal layer structure formed on plastic surface and surface treatment technology

Abstract

The invention discloses a metal layer structure formed on a plastic surface. The structure includes a primer layer formed on a plastic substrate surface, a metal texture layer formed on the primer layer, which is a conductive film formed by an ion sputtering method, a pyrophosphate copper layer / Watt nickel layer formed on the metal texture layer, a light copper layer formed on the pyrophosphate copper layer / Watt nickel layer, a semi light nickel layer formed on the light copper layer, a light nickel layer formed on the semi light nickel layer, a sealing nickel layer formed on a light nickel layer, and a light chromium layer formed on the sealing nickel layer. The invention also provides a surface treatment technology of the metal layer structure formed on plastic surface. According to the metal layer structure formed on plastic surface provided by the invention, the primer layer arranged between the plastic substrate surface and metal texture layer can effectively increase the types of plastic electroplating products, improve the smoothness of the material surface to enhance the bonding strength of the finished product, and effectively solve the problems of high content of chemical plating leakage and poor hot and cold resistance performance due to insufficient coarsening of a plastic electroplating piece with high PC content.

Description

technical field [0001] The invention relates to the technical field of plastic surface treatment, in particular to a metal layer structure formed on the plastic surface and a surface treatment process thereof. Background technique [0002] Plastic electroplating is a typical combination of new materials and new processes in modern processing technology. After years of research and development, it has become a mature technology. With the development of high technology in the 21st century, the application of plastic electroplating in engineering and functions has been greatly expanded, and some new technologies will emerge, such as electroplating copper on ceramic substrates to make special capacitors, and for small transformers in all plastic packages. The outer packaging plastic is electroplated to shield the electromagnetic field, and the production of the nickel foam electrode is made of plastic, which increases the life of the battery. Therefore, plastic electroplating i...

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Problems solved by technology

[0004] However, the existing plastic electroplating materials are diversified, and the content ratio of ABS and PC is different, and the pre-plating treatment also needs to be changed accordingly. Although the increase of PC content in plastic parts improves the performance of high temperature resistance, etc., it is easy to cause missing plating and poor bonding force of products after electroplating due to insufficient roughening in the pretreatment of electroplating.

In addition, there are many processes in the pre-plating treatment, which is complicated and time-consuming. Among them, roughening, palladium water and other processes have high heavy metal content, which will cause certain harm to the environment.

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